Method for stripping sacrificial layer in MEMS assembly
AssigneeTexas Instruments Incorporated
InventorJoshua Malone
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Abstract
The present invention provides methods of manufacturing a MEMS assembly. In one embodiment, the method includes mounting a MEMS device, such as a MEMS mirror array, on an assembly substrate, where the MEMS device has a sacrificial layer over components formed therein. The method also includes coupling an assembly lid to the assembly substrate and over the MEMS device to create an interior of the MEMS assembly housing the MEMS device, whereby the coupling maintains an opening to the interior of the MEMS assembly. Furthermore, the method includes removing the sacrificial layer through the opening. A MEMS assembly constructed according to a process of the present invention is also disclosed.
Claims10
A method of manufacturing a MEMS assembly, comprising:
- mounting a MEMS device on an assembly substrate, the MEMS device having a sacrificial layer;
- coupling an assembly lid to the assembly substrate and over the MEMS device to create an interior of the MEMS assembly housing the MEMS device, the coupling maintaining an opening to the interior of the MEMS assembly;
- and
- removing the sacrificial layer through the opening.
Dependencies are inferred from the claim text.