22,986 results
- US 2026/0323840 A1Published 15 Oct 2026Micro-nanoscale additive manufacturing method and patterning method
Shanghaitech University
- US 2026/0317162 A1Published 15 Oct 2026Micro-electro-mechanical system package and fabrication method thereof
Vanguard International Semiconductor Corporation
- US 2026/0317160 A1Published 15 Oct 2026Microelectromechanical sensor component, microelectromechanical inertial sensor, and method for producing a microelectromechanical sensor component
Jochen Reinmuth, Andrea Urban +1inventors
- US 12,764,484 B2Granted 13 Oct 2026
- US 12,759,867 B2Granted 13 Oct 2026MEMS structure with reduced peeling and methods forming the same
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 2026/0307983 A1Published 8 Oct 2026Method for producing a microelectromechanical device comprising a cap structure and a microelectromechanical device
Heribert Weber, Franziska Rohlfing +1inventors
- US 2026/0307982 A1Published 8 Oct 2026
- US 2026/0307981 A1Published 8 Oct 2026Micromechanical arm array for mems actuators
Taiwan Semiconductor Manufacturing Company, Ltd.
- US 2026/0307980 A1Published 8 Oct 2026
- US 12,753,070 B2Granted 6 Oct 2026MEMS resonator
SiTime Corporation
- US 12,753,068 B2Granted 6 Oct 2026Engineered substrates, free-standing semiconductor microstructures, and related systems and methods
Lawrence Semiconductor Research Laboratory, Inc.
- US 12,753,067 B2Granted 6 Oct 2026
- US 12,752,371 B1Granted 6 Oct 2026Femtosecond laser surface processing for controlled fill and targeted deposition
Honeywell Federal Manufacturing & Technologies, LLC
- US RE51,062 E1Granted 6 Oct 2026Multiple plated via arrays of different wire heights on a same substrate
Adeia Semiconductor Technologies LLC
- US 2026/0302128 A1Published 1 Oct 2026Microchips for use in electron microscopes and related methods
Northwestern University
- US 2026/0296882 A1Published 1 Oct 2026Method for manufacturing a microelectromechanical component, and microelectromechanical component
Marcus Pritschow, Raphael Schulerinventors
- US 2026/0296881 A1Published 1 Oct 2026Manufacturing a microphone by bonding layers
InvenSense, Inc.
- US 2026/0296880 A1Published 1 Oct 2026Wafer level proximity sensor and method of making same
STMicroelectronics International N.V.
- US 2026/0296879 A1Published 1 Oct 2026Micro-electro-mechanical system package and fabrication method thereof
Vanguard International Semiconductor Corporation
- US 2026/0296878 A1Published 1 Oct 2026Electronic devices and methods of manufacturing electronic devices
Amkor Technology Singapore Holding Pte. Ltd.
- US 2026/0296876 A1Published 1 Oct 2026Anchor structure
Lawrence Semiconductor Research Laboratory, Inc.
- US 12,747,156 B2Granted 29 Sep 2026
- US 12,747,155 B2Granted 29 Sep 2026Wafer level package for device
Teknologian tutkimuskeskus VTT Oy
- US 12,747,154 B2Granted 29 Sep 2026Micro-electro-mechanical system and manufacturing method thereof
Beijing BOE Technology Development Co., Ltd.
- US 12,747,153 B2Granted 29 Sep 2026Composite spring structure to reinforce mechanical robustness of a mems device
Taiwan Semiconductor Manufacturing Company, Ltd.