Hermetically sealed glass package
AssigneeSchott AG
InventorsJens Ulrich Thomas, Thorsten Damm, Thomas Zetterer
Life of this patent
Estimating the term…
Abstract
A package for encapsulating a functional area against an environment includes a base substrate and a cover substrate, the base substrate together with the cover substrate defining at least part of the package or defining the package, and furthermore including the at least one functional area provided in the package, and a blocking way for reducing permeation between the environment and the functional area. The package may include at least one laser bonding line, and the substrates of the package can be hermetically joined to one another by the at least one laser bonding line, and the laser bonding line has a height (HL) perpendicular to its bonding plane.
Claims27
A package for encapsulating at least one functional area against an environment, the package comprising:
- a base substrate;
- a cover substrate, the base substrate together with the cover substrate defining at least a part of the package or defining the package, the at least one functional area being provided inside the package;
- at least one blocking way configured for reducing a permeation between the environment and the at least one functional area;
- and
- at least one laser bonding line for hermetically joining two adjacent substrates of the package, wherein the at least one laser bonding line comprises mixed melted material from said two adjacent substrates, wherein the at least one laser bonding line has a height (HL) perpendicular to a bonding plane of the at least one laser bonding line, the at least one laser bonding line extending into the two adjacent substrates joined by said at least one laser bonding line.
A package, comprising:
- at least one cavity which is at least one hermetically sealed accommodation cavity, the package being produced by a method, wherein the package encloses at least one functional area including the at least one cavity, the method comprising the steps of:
- providing a base substrate and a cover substrate, the cover substrate being transparent for at least one range of wavelengths at least partially or in portions thereof and therefore being a transparent cover substrate;
- arranging the cover substrate on the base substrate and above the at least one functional area thereby creating at least one contact area between the base substrate and the cover substrate, so that the package has at least one contact area;
- hermetically sealing the at least one functional area including the at least one cavity by forming at least one laser bonding line along the at least one contact area of the package, wherein the at least one laser bonding line comprises mixed melted material from the two adjacent substrates, wherein the at least one laser bonding line has a height (HL) perpendicular to a bonding plane of the at least one laser bonding line, the at least one laser bonding line extending into the two adjacent substrates joined by said at least one laser bonding line;
- and
- arranging a blocking way at least one of between the at least one functional area and the cover substrate and between the at least one functional area and the base substrate.
Dependencies are inferred from the claim text.