Lid structure for microdevice and method of manufacture
AssigneeInnovative Micro Technology
InventorsSteven H. Hovey, Hung D. Nguyen
Life of this patent
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Abstract
A system and a method are described for forming features at the bottom of a cavity in a substrate. Embodiments of the systems and methods provide an infrared transmitting, hermetic lid for a microdevice. The lid may be manufactured by first forming small, subwavelength features on a surface of an infrared transmitting substrate, and coating the subwavelength features with an etch stop material. A spacer wafer is then bonded to the infrared transmitting substrate, and a device cavity is etched into the spacer wafer down to the etch stop material, exposing the subwavelength features. The etch stop material may then be removed, and the microdevice enclosed in the device cavity, by bonding the device wafer to the lid.
Claims9
A structure for a microdevice, comprising:
- a first substrate with a first plurality of features formed on a surface of the first substrate;
- a spacer wafer bonded to the first substrate with a cavity formed in the spacer wafer to expose at least some of the plurality of features to the environment of the cavity;
- and an etch stop material disposed between the first substrate and the spacer wafer;
- and a second substrate bonded to the first substrate and the spacer wafer, with a microdevice formed on the second substrate and disposed in the cavity of the spacer wafer.
Dependencies are inferred from the claim text.