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AssigneeFraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
InventorsMarten Oldsen, Ulrich Hofmann
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The present invention relates to a housing for one or more micromechanical and/or micro-optic components, wherein the housing exhibits a supporting substrate having at least one micromechanical and/or micro-optic component and at least one cap substrate, which is joined to the supporting substrate. The supporting substrate and the at least one cap substrate form at least one cavity, which at least partially encloses the at least one micromechanical and/or micro-optic component, wherein the side of at least one cap substrate facing the at least one micromechanical and/or micro-optic component exhibits at least one optical window and at least one mechanical stop. Furthermore, the object of the present invention is a method for producing such a housing, wherein the method is particularly usable for encapsulation at the wafer level.
Housing for one or more microcomponents (12), exhibiting a supporting substrate (1), having at least one microcomponent (12), and at least one cap substrate (2, 3), which is joined to the supporting substrate (1)—wherein by means of the supporting substrate (1) and the at least one cap substrate (2) at least one cavity (5) is formed that includes at least partially the at least one microcomponent (12)—and the side of which cap substrate facing the at least one microcomponent (12) exhibits an optical window (13) and a mechanical stop (8) characterized in that the mechanical stop (8) is integral with the cap substrate (2,3) and the optical window (13) exhibits an evenness and/or plane parallelism deviation of less than or equal to 3.75 μm.
Method for producing a housing for one or more microcomponents (12), exhibiting a supporting substrate (1), having at least one microcomponent (12), and at least one cap substrate (2, 3), which is joined to the supporting substrate (1)—wherein by means of the supporting substrate (1) and the at least one cap substrate (2) at least one cavity (5) is formed that includes at least partially the at least one microcomponent (12)—and the side of which cap substrate facing the at least one microcomponent (12) exhibits an optical window (13) and a mechanical stop (8), said method comprising the following steps:
Dependencies are inferred from the claim text.