B81C 1/00269
Bonding of solid lids or wafers to the substrate
Official title: {Bonding of solid lids or wafers to the substrate}
B81C1/00269 (Bonding of solid lids or wafers to the substrate) appears on 680 US grants and 848 published applications in this corpus.
Search patents in B81C- Granted patents
- 680
- Published applications
- 848
- Assignees
- 280
- Inventors
- 1,355
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 4 | 0 |
| 2001 | 3 | 3 |
| 2002 | 3 | 5 |
| 2003 | 7 | 10 |
| 2004 | 15 | 27 |
| 2005 | 14 | 35 |
| 2006 | 15 | 36 |
| 2007 | 19 | 45 |
| 2008 | 20 | 26 |
| 2009 | 25 | 28 |
| 2010 | 17 | 26 |
| 2011 | 31 | 30 |
| 2012 | 14 | 41 |
| 2013 | 29 | 37 |
| 2014 | 41 | 47 |
| 2015 | 51 | 63 |
| 2016 | 55 | 52 |
| 2017 | 48 | 53 |
| 2018 | 45 | 46 |
| 2019 | 45 | 35 |
| 2020 | 46 | 47 |
| 2021 | 31 | 39 |
| 2022 | 20 | 19 |
| 2023 | 25 | 24 |
| 2024 | 23 | 29 |
| 2025 | 18 | 28 |
| 2026 | 14 | 17 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- MEMS device with an improved cap and related manufacturing process8 Sep 2026US 12,729,110 B2STMicroelectronics S,r.l.
- Process for manufacturing a micro-electro-mechanical device including two chambers at different pressures and related micro-electro-mechanical device1 Sep 2026US 12,722,969 B2STMicroelectronics S,r.l.
- Method for bonding a microelectromechanical device18 Aug 2026US 12,709,539 B2Murata Manufacturing Co., Ltd.
- Semiconductor structure and manufacturing method for the same4 Aug 2026US 12,698,201 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Micro-electro-mechanical system package and fabrication method thereof14 Jul 2026US 12,679,722 B2Vanguard International Semiconductor Corporation
- Electronic devices and methods of manufacturing electronic devices1 Oct 2026US 2026/0296878 A1Amkor Technology Singapore Holding Pte. Ltd.
- Vacuum encapsulation24 Sep 2026US 2026/0285675 A1Obsidian Sensors, Inc.
- Method of fabricating micro-electro-mechanical system package24 Sep 2026US 2026/0285676 A1Vanguard International Semiconductor Corporation
- Microelectromechanical device and a method20 Aug 2026US 2026/0242204 A1Murata Manufacturing Co., Ltd.
- A micro-electro-mechanical system sensor and a preparation method thereof20 Aug 2026US 2026/0242210 A1Memsensing Microsystems (Suzhou, China) Co., Ltd.
Most cited
By later US patents
- Semiconductor device including eutectic bonding portion and method for manufacturing the same314US 6,555,901 B1Denso Corporation · 2003
- Method and structure for wafer to wafer bonding in semiconductor packaging237US 8,377,798 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2013
- Method for packaging microsensors228US 6,140,144 AIntegrated Sensing Systems, Inc. · 2000
- Process for making microstructures and microstructures made thereby196US 6,232,150 B1The Regents of the University of Michigan · 2001
- Bonded structures181US 10,002,844 B1Invensas Bonding Technologies, Inc. · 2018