Process for manufacturing a micro-electro-mechanical device including two chambers at different pressures and related micro-electro-mechanical device

A device, comprising:

• a cap including:
• a semiconductive substrate;
• a dielectric region that coats part of the semiconductive substrate;
• and
• a permeable region, which is permeable to gases, that coats the dielectric region, and the dielectric region is interposed between the semiconductive substrate and the permeable region;
• a main body coupled to the cap, the main body including a first cavity, a second cavity, a first movable mass, and a second movable mass, the first movable mass is suspended over the first cavity and the second movable mass is suspended over the second cavity;
• a first chamber is delimited by a corresponding portion of the cap, the first chamber includes the first cavity and houses the first movable mass, the first chamber being hermetically closed, a first pressure within the first chamber being equal to a first value;
• and
• a second chamber is delimited by a corresponding portion of the cap, the second chamber includes the second cavity and houses the second movable mass, the second chamber being hermetically closed, a second pressure within the second chamber being equal to a second value, the permeable region overlaps the second chamber;
• an opening that extends through the semiconductive substrate and the dielectric region to the permeable region;
• and
• a sealing region, which is impermeable to gases, that extends into the opening to the permeable region and hermetically closes the second chamber.

A device, comprising:

• a main body including:
• a first side and a second side opposite to the first side;
• a first cavity and a second cavity at the first side, the first cavity is spaced apart from the second cavity;
• and
• a first movable mass suspended over the first cavity and a second movable mass suspended over the second cavity;
• a cap coupled to the first side of the main body overlapping the first cavity, the second cavity, the first movable mass, and the second movable mass, the cap including:
• a third side and a fourth side opposite to the third side, the third side is coupled to the first side of the main body;
• a substrate including a first cap cavity overlapping the first cavity and the first movable mass, a second cap cavity overlapping the second cavity and the second movable mass, and a third cap cavity between the first cap cavity and the second cap cavity;
• a dielectric layer is within the third cap cavity and lines the third cap cavity;
• and
• a permeable layer is within the third cap cavity and is on the dielectric layer, the permeable layer is spaced apart from the substrate by the dielectric layer;
• a sealing layer extends into the fourth side of the cap, wherein the sealing layer extends through the substrate and extends through the dielectric layer to the permeable layer within the third cap cavity;
• a glass-frit region couples the third side of the cap to the first side of the main body, the glass-frit region defines:
• a first chamber housing the first movable mass, the first chamber includes the first cavity and the first cap cavity, the first chamber is hermetically closed;
• and
• a second chamber housing the second movable mass, the second chamber includes the second cavity, the second cap cavity, and the third cap cavity, the second chamber is hermetically closed.