Micro-electro-mechanical system package and fabrication method thereof

A micro-electro-mechanical system (MEMS) package, comprising:

• a wafer;
• an interconnect layer, disposed on the wafer;
• a first device substrate comprising a first MEMS device and disposed on the wafer;
• a second device substrate comprising a second MEMS device, laterally spaced apart from the first device substrate and disposed on the wafer;
• a first bond seal ring, disposed below the first device substrate and bonded to the interconnect layer;
• a second bond seal ring, disposed below the second device substrate and bonded to the interconnect layer;
• a first handle substrate, including a first cavity and bonded to the first device substrate;
• a second handle substrate, including a second cavity and bonded to the second device substrate;
• a hole, disposed in the second bond seal ring and vertically passing through the second bond seal ring;
• and
• a dielectric film, disposed on the interconnect layer and adjacent to the first bond seal ring and the second bond seal ring,
• wherein the first cavity has a first pressure, and the second cavity has a second pressure different from the first pressure.