B81C 1/00301
Connecting electric signal lines from the mems device with external electrical signal
Official title: {Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias}
B81C1/00301 (Connecting electric signal lines from the mems device with external electrical signal) appears on 511 US grants and 558 published applications in this corpus.
Search patents in B81C- Granted patents
- 511
- Published applications
- 558
- Assignees
- 211
- Inventors
- 857
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 0 | 0 |
| 1999 | 2 | 0 |
| 2000 | 2 | 0 |
| 2001 | 2 | 1 |
| 2002 | 4 | 7 |
| 2003 | 1 | 3 |
| 2004 | 6 | 12 |
| 2005 | 10 | 19 |
| 2006 | 7 | 20 |
| 2007 | 8 | 36 |
| 2008 | 10 | 24 |
| 2009 | 18 | 14 |
| 2010 | 19 | 12 |
| 2011 | 14 | 10 |
| 2012 | 18 | 19 |
| 2013 | 13 | 30 |
| 2014 | 37 | 27 |
| 2015 | 46 | 49 |
| 2016 | 54 | 43 |
| 2017 | 36 | 30 |
| 2018 | 34 | 46 |
| 2019 | 36 | 36 |
| 2020 | 37 | 31 |
| 2021 | 18 | 23 |
| 2022 | 25 | 15 |
| 2023 | 13 | 16 |
| 2024 | 14 | 15 |
| 2025 | 10 | 9 |
| 2026 | 11 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Methods for fabrication of MEMS device11 Aug 2026US 12,703,624 B2Omnitron Sensors Inc.
- MEMS pressure sensor11 Aug 2026US 12,704,427 B2MEI Micro, Inc.
- Stacked die package and methods of forming the same23 Jun 2026US 12,667,009 B2Qorvo US, Inc.
- Process flow for thin contactless thermal sensors16 Jun 2026US 12,656,179 B2STMicroelectronics International N. V.
- Techniques to enable a flip chip underfill exclusion zone12 May 2026US 12,628,686 B2Intel Corporation
- Through-hole electrode substrate, mems device, manufacturing method of mems device, and multilayered device17 Sep 2026US 2026/0274651 A1TDK Corporation
- Process flow for thin contactless thermal sensors17 Sep 2026US 2026/0276451 A1STMicroelectronics International N. V.
- Stacked die package and methods of forming the same17 Sep 2026US 2026/0283037 A1Qorvo US, Inc.
- Asic capped mems device20 Aug 2026US 2026/0242209 A1Murata Manufacturing Co., Ltd.
- Manufacturing method for microelectromechanical devices and microelectromechanical device thereof20 Aug 2026US 2026/0242211 A1STMicroelectronics International N. V.
Most cited
By later US patents
- Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips273US 9,368,429 B2Intel Corporation · 2016
- Method for packaging microsensors228US 6,140,144 AIntegrated Sensing Systems, Inc. · 2000
- Micro-electromechanical system device191US 6,384,353 B1Motorola, Inc. · 2002
- Method for manufacturing a semiconductor acceleration sensor device157US 5,668,033 ANippondenso Co., Ltd. · 1997
- Methods for producing packaged integrated circuit devices & packaged integrated circuit devices produced thereby157US 6,777,767 B2Shellcase Ltd. · 2004