Asic capped mems device

A microelectromechanical (MEMS) device comprising:

• an ASIC layer comprising:
• an ASIC metal stack towards a first face of the ASIC layer that comprises a plurality of coupling elements that are electrically coupled to the ASIC metal stack,
• a substrate towards a second face of the ASIC layer and having a face that faces the ASIC metal stack and comprises ASIC active circuitry, wherein the ASIC metal stack is configured to convey signals between the ASIC active circuitry and the plurality of coupling elements;
• a MEMS device layer comprising functional elements of the MEMS device, the MEMS device layer having a first face and a second face, wherein parts of the second face of the MEMS device layer are bonded to parts of the first face of the ASIC layer;
• and
• a cap layer having a first face and a second face, wherein parts of the second face of the cap layer are bonded to parts of the first face of the MEMS device layer and a plurality of metal pads are on first face of the cap layer,
• wherein the cap layer, the ASIC layer and parts of the MEMS device layer form an enclosure for at least all movable functional elements of the MEMS device layer,
• wherein mutually electrically connected parts of the MEMS device layer and the cap layer form at least one ASIC signal through-silicon-via (AS-TSV) that is configured to electrically connect signals of the ASIC active circuitry via at least one electrical contact on the first face of the ASIC metal stack to respective pads of the plurality of metal pads on the first face of the cap layer, and
• wherein the MEMS device layer comprises at least one movable element configured to be moveable in out-of-plane direction between the first face of the ASIC layer and the second face of the cap layer.