B81C 1/00325
For reducing stress inside of the package structure
Official title: {for reducing stress inside of the package structure}
B81C1/00325 (For reducing stress inside of the package structure) appears on 119 US grants and 130 published applications in this corpus.
Search patents in B81C- Granted patents
- 119
- Published applications
- 130
- Assignees
- 51
- Inventors
- 255
- Latest grant
- 16 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2003 | 0 | 1 |
| 2004 | 0 | 0 |
| 2005 | 1 | 0 |
| 2006 | 0 | 0 |
| 2007 | 0 | 0 |
| 2008 | 0 | 0 |
| 2009 | 0 | 1 |
| 2010 | 0 | 2 |
| 2011 | 1 | 1 |
| 2012 | 1 | 0 |
| 2013 | 1 | 4 |
| 2014 | 3 | 5 |
| 2015 | 6 | 10 |
| 2016 | 8 | 10 |
| 2017 | 11 | 19 |
| 2018 | 13 | 5 |
| 2019 | 11 | 10 |
| 2020 | 12 | 16 |
| 2021 | 11 | 18 |
| 2022 | 8 | 9 |
| 2023 | 16 | 5 |
| 2024 | 10 | 7 |
| 2025 | 4 | 3 |
| 2026 | 2 | 4 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method for producing a microelectromechanical component16 Jun 2026US 12,655,018 B2Robert Bosch GmbH
- High reliability sensor24 Feb 2026US 12,559,363 B2Texas Instruments Incorporated
- Embedded digital sensor structure9 Sep 2025US 12,410,053 B1Tacta Systems Inc.
- Methods and apparatus for electronic device packaging22 Jul 2025US 12,365,584 B2Texas Instruments Incorporated
- MEMS device built using the BEOL metal layers of a solid state semiconductor process28 Jan 2025US 12,209,009 B2Nanusens SL
- Mems device built using the beol metal layers of a solid state semiconductor process16 Jul 2026US 2026/0200722 A1Nanusens SL
- Method for bonding a mems to a substrate25 Jun 2026US 2026/0176131 A1Exail
- Low stress flipchip mems package26 Mar 2026US 2026/0084956 A1STMicroelectronics International N. V.
- Embedded Digital Sensor Structure29 Jan 2026US 2026/0028224 A1Tacta Systems Inc.
- Methods and apparatus for electronic device packaging9 Oct 2025US 2025/0313454 A1
Most cited
By later US patents
- MEMS device structure and methods of forming same49US 9,139,420 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Fabrication of microstructures with vacuum-sealed cavity29US 6,902,656 B2DALSA Semiconductor Inc. · 2005
- Sensor and method for manufacturing a sensor19US 9,227,837 B2Robert Bosch GmbH · 2016
- Method for forming a capped micro-electro-mechanical system (MEMS) device13US 8,039,312 B1Freescale Semiconductor, Inc. · 2011
- Micro-electro-mechanical device having two buried cavities and manufacturing process thereof12US 9,688,531 B2STMicroelectronics S,r.l. · 2017