Sensor and method for manufacturing a sensor

A method for manufacturing a sensor having a substrate, a microelectromechanical structure, and a decoupling structure anchored on the substrate, wherein the microelectromechanical structure is anchored on the decoupling structure, and wherein the microelectromechanical structure and the decoupling structure are movable in relation to the substrate, and wherein the decoupling structure is situated between the microelectromechanical structure and the substrate, the method comprising:

• producing on one side of a substrate, in a first manufacturing step, a channel structure extending into the substrate;
• producing, in a subsequent manufacturing step following the first manufacturing step, a decoupling structure from a decoupling layer situated on a side of the substrate;
• applying, in a still further manufacturing step, a functional layer to the decoupling layer;
• and
• forming, from the functional layer, a microelectromechanical structure anchored on the decoupling structure.