Method for producing a microelectromechanical component

A method for producing a microelectromechanical component, comprising the following steps:

• arranging a dielectric layer on an upper side of a first substrate;
• structuring the dielectric layer, wherein a grating with grating openings extending to the upper side of the first substrate is formed in the dielectric layer;
• removing a material of the first substrate in a region below the grating, forming a first blind hole in the upper side of the first substrate, wherein the grating remains above the first blind hole;
• arranging a cover layer on a side of the dielectric layer facing away from the first substrate, closing the first blind hole;
• arranging a layer sequence on a side of the cover layer facing away from the first substrate and above the closed first blind hole;
• forming and exposing functional structures of the microelectromechanical component by structuring the layer sequence;
• forming an access channel extending through the layer sequence to the first blind hole;
• arranging a second substrate on a side of the layer sequence facing away from the first substrate and connecting the first substrate and the second substrate, wherein the functional structures of the microelectromechanical component are enclosed in a cavity formed between the first substrate and the second substrate, and the cavity is connected to the first blind hole via the access channel;
• forming a second blind hole on an underside of the first substrate opposite the upper side and opening the first blind hole in a region of the second blind hole;
• and
• setting a cavity internal pressure in the cavity and closing the first blind hole in the region of the second blind hole.