B81C 1/00309
Suitable for fluid transfer from the mems out of the package or
Official title: {suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound}
B81C1/00309 (Suitable for fluid transfer from the mems out of the package or) appears on 164 US grants and 201 published applications in this corpus.
Search patents in B81C- Granted patents
- 164
- Published applications
- 201
- Assignees
- 86
- Inventors
- 396
- Latest grant
- 26 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2006 | 1 | 1 |
| 2007 | 1 | 2 |
| 2008 | 0 | 0 |
| 2009 | 0 | 4 |
| 2010 | 2 | 1 |
| 2011 | 0 | 2 |
| 2012 | 4 | 8 |
| 2013 | 3 | 5 |
| 2014 | 6 | 10 |
| 2015 | 15 | 9 |
| 2016 | 10 | 13 |
| 2017 | 15 | 19 |
| 2018 | 10 | 21 |
| 2019 | 14 | 16 |
| 2020 | 22 | 23 |
| 2021 | 14 | 13 |
| 2022 | 15 | 12 |
| 2023 | 9 | 14 |
| 2024 | 7 | 8 |
| 2025 | 9 | 8 |
| 2026 | 7 | 12 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Wafer level chip scale packaging with sensor26 May 2026US 12,637,349 B2Stmicroelectronics Pte Ltd
- Pressure transducer package having a rigid transfer block for assembly tolerance19 May 2026US 12,630,417 B2Infineon Technologies AG
- Production method for a micromechanical sensor apparatus, and corresponding micromechanical sensor apparatus19 May 2026US 12,630,419 B2Robert Bosch GmbH
- Methods of manufacturing plasma generating cells for a plasma source14 Apr 2026US 12,601,621 B2APPLIED Materials.Inc.
- Sensor assembly and methods of manufacturing thereof17 Feb 2026US 12,553,751 B2APPLIED Materials.Inc.
- Wafer level chip scale packaging with sensor10 Sep 2026US 2026/0265047 A1Stmicroelectronics Pte Ltd
- Micromechanical sensor device and corresponding production method3 Sep 2026US 2026/0257909 A1
- Micromechanical component for a sensor device, microphone device and/or micro-loudspeaker device27 Aug 2026US 2026/0250121 A1
- Microsensor with a protective mass16 Jul 2026US 2026/0200725 A1
- Methods of manufacturing plasma generating cells for a plasma source16 Jul 2026US 2026/0202227 A1APPLIED Materials.Inc.
Most cited
By later US patents
- MEMS package using flexible substrates, and method thereof94US 7,202,552 B2Silicon Matrix Pte. Ltd. · 2007
- MEMS integrated pressure sensor devices and methods of forming same66US 9,040,334 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- MEMS devices and methods for forming same61US 9,085,455 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- MEMS integrated pressure sensor and microphone devices and methods of forming same58US 9,187,317 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Methods and apparatus having wafer level chip scale package for sensing elements51US 7,109,055 B2Freescale Semiconductor, Inc. · 2006