Pressure transducer package having a rigid transfer block for assembly tolerance

A pressure transducer device comprising:

• a substrate and a lid attached to the substrate, including a cavity defined underneath the lid;
• a MEMS pressure transducer arranged inside the cavity;
• a fluid port configured for allowing a fluid exchange between an interior and an exterior of the cavity, the MEMS pressure transducer covering the fluid port;
• a package pad configured for electrically contacting the MEMS pressure transducer from outside a package of the pressure transducer device, wherein the package pad is provided at a first side of the package and the fluid port is provided at a second side of the package opposite the first side;
• and
• a transfer block arranged inside the cavity, the transfer block being rigid and configured to provide an electric path between the MEMS pressure transducer and the package pad,
• wherein at least one of the lid or the transfer block comprises an assembly tolerance portion configured for accommodating a mechanical assembly tolerance between the transfer block and at least one of the substrate or the lid, and
• wherein the MEMS pressure transducer is attached to at least one of the substrate or the lid.

A method for providing a pressure transducer device, the method comprising:

• providing a substrate and a lid attached to the substrate, including a cavity defined underneath the lid;
• providing a MEMS pressure transducer arranged inside the cavity;
• providing a fluid port for allowing a fluid exchange between an interior and an exterior of the cavity, the MEMS pressure transducer covering the fluid port;
• providing a package pad for electrically contacting the MEMS pressure transducer from outside a package of the pressure transducer device, wherein the package pad is provided at a first side of the package and the fluid port is provided at a second side of the package opposite the first side;
• providing a transfer block arranged inside the cavity, the transfer block being rigid and configured to provide an electric path between the MEMS pressure transducer and the package pad;
• and
• providing an assembly tolerance portion for accommodating a mechanical assembly tolerance between the transfer block and at least one of the substrate or the lid,
• wherein at least one of the lid or the transfer block comprises the assembly tolerance portion.