Production method for a micromechanical sensor apparatus, and corresponding micromechanical sensor apparatus

A production method for a micromechanical sensor apparatus, comprising the following steps:

• providing a bonded wafer stack including an ASIC wafer and a MEMS wafer bonded to the ASIC wafer, wherein the ASIC wafer includes a plurality of ASIC switching devices and the MEMS wafer includes a plurality of MEMS sensor devices, wherein each ASIC switching device and a corresponding MEMS sensor device are arranged one above the other such that they together form a respective micromechanical sensor apparatus in the bonded wafer stack;
• providing a first packaging wafer made of a glass material or a glass ceramic material or a ceramic material, the first packaging wafer having a first front face and a first rear face, wherein in the first rear face, the first packaging wafer has a plurality of blind holes which are each assigned to a corresponding sensor detection region of a respective one of the MEMS sensor devices in the bonded wafer stack;
• bonding the first rear face of the first packaging wafer to the wafer stack such that the blind holes are each in fluid connection with the corresponding sensor detection region of the MEMS sensor device;
• backthinning, on the first front face, the first packaging wafer bonded to the wafer stack to expose the blind holes on the first front face so that the sensor detection regions of the MEMS sensor devices in the bonded wafer stack are in fluid connection with outside through the exposed blind holes;
• and
• separating the micromechanical sensor apparatuses in the bonded wafer stack into a plurality of sensor chip stacks each with a respective one of the micromechanical sensor apparatuses.