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US 7,202,552 B2Granted
MEMS package using flexible substrates, and method thereof
AssigneeSilicon Matrix Pte. Ltd.
InventorsWang Zhe, Miao Yubo
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Abstract
A MEMS package and a method for its forming are described. The MEMS package has at least one MEMS device located on a flexible substrate. A metal structure surrounds the at least one MEMS device wherein a bottom surface of the metal structure is attached to the flexible substrate and wherein a portion of the flexible substrate is folded over a top surface of the metal structure and attached to the top surface of the metal structure thereby forming the MEMS package.
Claims31
A MEMS package comprising:
- at least one MEMS device located on a flexible substrate;
- and
- a metal structure surrounding said at least one MEMS device wherein a bottom surface of said metal structure is attached to said flexible substrate and wherein said flexible substrate is folded over a top surface of said metal structure and attached to said top surface of said metal structure thereby forming said MEMS package.
A method for fabricating a MEMS package comprising:
- mounting at least one MEMS device onto a flexible substrate;
- attaching a bottom surface of a metal structure to said flexible substrate surrounding said at least one MEMS device;
- and
- folding said flexible substrate over a top surface of said metal structure and attaching said flexible substrate to said top surface of said metal structure thereby forming said MEMS package.
1 more element
Dependencies are inferred from the claim text.