Methods and apparatus having wafer level chip scale package for sensing elements

A method for manufacturing a sensor comprising:

• depositing a sacrificial material at a first predetermined thickness onto a wafer having at least one sense element mounted thereon, the sacrificial material having thixotropic properties and having a capability to withstand a temperature of at least about 140° C. and being deposited at least partially onto the at least one sense element;
• forming an encapsulating layer at a second predetermined thickness less than the first predetermined thickness over the wafer and around the deposited sacrificial material;
• and
• removing the sacrificial material.

A sensor comprising:

• a wafer having a first and a second side, each of the wafer and second sides having a surface;
• an interconnect extending between the wafer first and second sides and including a first end and a second end, the interconnect first end exposed at the surface of the wafer first side and the interconnect second end exposed at and extending alone a portion of the surface of the wafer second side;
• a sense element coupled to and disposed over the wafer second side the sense element including a first portion and a second portion, the first portion in contact with the interconnect second end;
• circuitry formed in the wafer second side contacting the interconnect and the sense element;
• and
• an encapsulant layer coupled to the wafer second side, the encapsulant layer having an opening formed therethrough exposing the sense element second portion.