B81C 1/00277
For maintaining a controlled atmosphere inside of the cavity containing the mems
Official title: {for maintaining a controlled atmosphere inside of the cavity containing the MEMS}
B81C1/00277 (For maintaining a controlled atmosphere inside of the cavity containing the mems) appears on 490 US grants and 611 published applications in this corpus.
Search patents in B81C- Granted patents
- 490
- Published applications
- 611
- Assignees
- 172
- Inventors
- 913
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 4 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 1 |
| 2002 | 4 | 4 |
| 2003 | 2 | 8 |
| 2004 | 4 | 15 |
| 2005 | 10 | 25 |
| 2006 | 6 | 8 |
| 2007 | 11 | 32 |
| 2008 | 6 | 26 |
| 2009 | 12 | 14 |
| 2010 | 19 | 15 |
| 2011 | 21 | 18 |
| 2012 | 12 | 17 |
| 2013 | 22 | 23 |
| 2014 | 16 | 23 |
| 2015 | 37 | 53 |
| 2016 | 34 | 56 |
| 2017 | 48 | 55 |
| 2018 | 44 | 29 |
| 2019 | 34 | 26 |
| 2020 | 35 | 36 |
| 2021 | 22 | 20 |
| 2022 | 17 | 25 |
| 2023 | 21 | 22 |
| 2024 | 12 | 25 |
| 2025 | 21 | 21 |
| 2026 | 14 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Method for producing a micromechanical device comprising a cavity having a melt seal29 Sep 2026US 12,747,156 B2Robert Bosch GmbH
- Microelectromechanical systems package with a lateral vent hole connected to a cavity and method for manufacturing the same22 Sep 2026US 12,741,863 B2Vanguard International Semiconductor Corporation
- Method for bonding a microelectromechanical device18 Aug 2026US 12,709,539 B2Murata Manufacturing Co., Ltd.
- Electronic device, electronic device manufacturing apparatus, and method for manufacturing electronic device11 Aug 2026US 12,703,622 B2Kabushiki Kaisha Toshiba
- Semiconductor structure and manufacturing method for the same4 Aug 2026US 12,698,201 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Deformation Bonded and Hermetically Sealed Vacuum MEMS Cells with Stopping Layer17 Sep 2026US 2026/0274653 A1HRL Laboratories, LLC
- Process flow for thin contactless thermal sensors17 Sep 2026US 2026/0276451 A1STMicroelectronics International N. V.
- Device and method of manufacturing device10 Sep 2026US 2026/0265048 A1Tazmo Co., Ltd.
- Manufacturing method for microelectromechanical devices and microelectromechanical device thereof20 Aug 2026US 2026/0242211 A1STMicroelectronics International N. V.
- Microelectromechanical system20 Aug 2026US 2026/0242214 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Method of fabrication of a microstructure having an internal cavity302US 6,297,072 B1Interuniversitair Micro-Elktronica Centrum (IMEC VZW) · 2001
- Bonded structures181US 10,002,844 B1Invensas Bonding Technologies, Inc. · 2018
- Seal for microelectronic assembly142US 10,508,030 B2Invensas Bonding Technologies, Inc. · 2019
- Hermetically sealed micro-device package with window110US 6,627,814 B12003
- Method of forming a reactive material and article formed thereby104US 6,923,625 B2Integrated Sensing Systems, Inc. · 2005