US 2026/0242214 A1Published application

Microelectromechanical system

AssigneeMurata Manufacturing Co., Ltd.

InventorsAntti IIHOLA, Matti Liukku

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Abstract

A microelectromechanical system is provided that includes an ASIC layer, an interposer layer, a MEMS layer and a cap layer attached one to another. The MEMS system further includes an isolated enclosure formed between the interposer layer and the cap layer. The interposer layer includes a measurement electrode inside the isolated enclosure. An advantage of the disclosure is that the interposer layer comprises measurement electrode, and not the ASIC wafer so that no structural modifications to the ASIC wafer are required. In addition, structure of the disclosed MEMS system allows arranging the insulated enclosure with the desired pressure inside.

Claims20

Dependent claims

A microelectromechanical system comprising:

an ASIC layer comprising a control circuit,
an interposer layer comprising a first side and a second side, wherein the ASIC layer is bonded to the first side of the interposer layer, and
a MEMS layer comprising a first side and a second side, wherein the second side of the interposer layer is attached to the first side of the MEMS layer,
a cap layer attached to the second side of the MEMS layer,
wherein the interposer layer and the cap layer form a first isolated enclosure with the MEMS layer inside, and the MEMS layer comprises a first movable structure,
wherein the first movable structure is located within the first isolated enclosure,
wherein the interposer layer further comprises a first measurement electrode at the second side, wherein the first measurement electrode is located adjacent to the first movable structure in the first isolated enclosure.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 19/539,437Filed 13 Feb 2026
Priority: EP 25158199.717 Feb 2025
Published: 20 Aug 2026
Term ends: Not estimatedThe source records don’t support an estimate.

Classification19 codes

G01P 15/0802
With conversion into electric or magnetic values: details
B81B 3/0021
Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors,…:…
B81B 7/007
Packages or encapsulation: interconnections between the MEMS and external electrical signals
B81B 7/02
Microstructural systems ; Auxiliary parts of microstructural devices or systems: containing distinct electrical or optical devices of particular…

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