B81C 1/00285
Using materials for controlling the level of pressure, contaminants or moisture inside
Official title: {using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters}
B81C1/00285 (Using materials for controlling the level of pressure, contaminants or moisture inside) appears on 221 US grants and 272 published applications in this corpus.
Search patents in B81C- Granted patents
- 221
- Published applications
- 272
- Assignees
- 97
- Inventors
- 466
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2002 | 1 | 1 |
| 2003 | 0 | 4 |
| 2004 | 1 | 5 |
| 2005 | 3 | 8 |
| 2006 | 3 | 5 |
| 2007 | 3 | 12 |
| 2008 | 3 | 12 |
| 2009 | 6 | 5 |
| 2010 | 13 | 4 |
| 2011 | 9 | 6 |
| 2012 | 5 | 5 |
| 2013 | 6 | 10 |
| 2014 | 7 | 12 |
| 2015 | 15 | 21 |
| 2016 | 19 | 28 |
| 2017 | 21 | 26 |
| 2018 | 20 | 13 |
| 2019 | 17 | 13 |
| 2020 | 14 | 13 |
| 2021 | 8 | 9 |
| 2022 | 9 | 14 |
| 2023 | 13 | 10 |
| 2024 | 5 | 13 |
| 2025 | 11 | 9 |
| 2026 | 9 | 14 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Method for producing a micromechanical device comprising a cavity having a melt seal29 Sep 2026US 12,747,156 B2Robert Bosch GmbH
- Electronic device, electronic device manufacturing apparatus, and method for manufacturing electronic device11 Aug 2026US 12,703,622 B2Kabushiki Kaisha Toshiba
- Semiconductor structure and manufacturing method for the same4 Aug 2026US 12,698,201 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Process flow for thin contactless thermal sensors16 Jun 2026US 12,656,179 B2STMicroelectronics International N. V.
- Inertial sensor, method for manufacturing inertial sensor, and inertial measurement unit19 May 2026US 12,631,665 B2Seiko Epson Corporation
- Deformation Bonded and Hermetically Sealed Vacuum MEMS Cells with Stopping Layer17 Sep 2026US 2026/0274653 A1HRL Laboratories, LLC
- Process flow for thin contactless thermal sensors17 Sep 2026US 2026/0276451 A1STMicroelectronics International N. V.
- Device and method of manufacturing device10 Sep 2026US 2026/0265048 A1Tazmo Co., Ltd.
- Manufacturing method for microelectromechanical devices and microelectromechanical device thereof20 Aug 2026US 2026/0242211 A1STMicroelectronics International N. V.
- Microelectromechanical system20 Aug 2026US 2026/0242214 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Method of forming a reactive material and article formed thereby104US 6,923,625 B2Integrated Sensing Systems, Inc. · 2005
- Methods for prevention, reduction, and elimination of outgassing and trapped gases in micromachined devices82US 6,499,354 B1Integrated Sensing Systems (ISSYS), Inc. · 2002
- Hermetic packaging and method of manufacture and use therefore60US 7,579,663 B22009
- Method for sealing and backside releasing of microelectromechanical systems53US 7,767,484 B2Georgia Tech Research Corporation · 2010
- System and method of fabricating micro cavities43US 7,265,429 B22007