B81C 1/00293
Maintaining a controlled atmosphere with processes not provided for in b81c1/00285
Official title: {maintaining a controlled atmosphere with processes not provided for in B81C1/00285}
B81C1/00293 (Maintaining a controlled atmosphere with processes not provided for in b81c1/00285) appears on 268 US grants and 331 published applications in this corpus.
Search patents in B81C- Granted patents
- 268
- Published applications
- 331
- Assignees
- 109
- Inventors
- 534
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1999 | 4 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 1 |
| 2002 | 3 | 3 |
| 2003 | 2 | 4 |
| 2004 | 3 | 10 |
| 2005 | 8 | 19 |
| 2006 | 3 | 3 |
| 2007 | 8 | 11 |
| 2008 | 3 | 14 |
| 2009 | 7 | 9 |
| 2010 | 7 | 11 |
| 2011 | 12 | 12 |
| 2012 | 7 | 11 |
| 2013 | 16 | 13 |
| 2014 | 9 | 15 |
| 2015 | 23 | 30 |
| 2016 | 14 | 28 |
| 2017 | 27 | 31 |
| 2018 | 26 | 14 |
| 2019 | 15 | 12 |
| 2020 | 19 | 23 |
| 2021 | 13 | 8 |
| 2022 | 8 | 11 |
| 2023 | 6 | 12 |
| 2024 | 7 | 13 |
| 2025 | 11 | 12 |
| 2026 | 5 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Microelectromechanical systems package with a lateral vent hole connected to a cavity and method for manufacturing the same22 Sep 2026US 12,741,863 B2Vanguard International Semiconductor Corporation
- Method for bonding a microelectromechanical device18 Aug 2026US 12,709,539 B2Murata Manufacturing Co., Ltd.
- Method for manufacturing semiconductor structure17 Mar 2026US 12,577,099 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Laterally-doped MEMS resonator with piezoelectric layer17 Feb 2026US 12,556,157 B1SiTime Corporation
- Hermetically sealed glass package10 Feb 2026US 12,550,779 B2Schott AG
- Manufacturing method for microelectromechanical devices and microelectromechanical device thereof20 Aug 2026US 2026/0242211 A1STMicroelectronics International N. V.
- Mems sensor with particle filter and method for producing it11 Dec 2025US 2025/0376370 A1Infineon Technologies AG
- Post cmp processing for hybrid bonding27 Nov 2025US 2025/0364481 A1Adeia Semiconductor Bonding Technologies Inc.
- Micromechanical device and method for producing a micromechanical device having a mems substrate and a cap substrate and a cavern enclosed by mems substrate and cap substrate13 Nov 2025US 2025/0346484 A1
- Seal for microelectronic assembly6 Nov 2025US 2025/0343086 A1Adeia Semiconductor Bonding Technologies Inc.
Most cited
By later US patents
- Method of fabrication of a microstructure having an internal cavity302US 6,297,072 B1Interuniversitair Micro-Elktronica Centrum (IMEC VZW) · 2001
- Bonded structures181US 10,002,844 B1Invensas Bonding Technologies, Inc. · 2018
- Seal for microelectronic assembly142US 10,508,030 B2Invensas Bonding Technologies, Inc. · 2019
- Hermetically sealed micro-device package with window110US 6,627,814 B12003
- Planar microshells for vacuum encapsulated devices and damascene method of manufacture94US 7,923,790 B1Silicon Laboratories Inc. · 2011