B81C 1/00333
Aspects relating to packaging of mems devices, not covered by groups b81c1/00269
Official title: {Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325}
B81C1/00333 (Aspects relating to packaging of mems devices, not covered by groups b81c1/00269) appears on 398 US grants and 445 published applications in this corpus.
Search patents in B81C- Granted patents
- 398
- Published applications
- 445
- Assignees
- 190
- Inventors
- 764
- Latest grant
- 31 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 1 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 2 |
| 2002 | 5 | 6 |
| 2003 | 4 | 14 |
| 2004 | 6 | 28 |
| 2005 | 22 | 37 |
| 2006 | 26 | 18 |
| 2007 | 13 | 23 |
| 2008 | 19 | 21 |
| 2009 | 13 | 22 |
| 2010 | 16 | 16 |
| 2011 | 18 | 19 |
| 2012 | 15 | 23 |
| 2013 | 20 | 22 |
| 2014 | 30 | 23 |
| 2015 | 30 | 23 |
| 2016 | 24 | 20 |
| 2017 | 20 | 29 |
| 2018 | 15 | 12 |
| 2019 | 18 | 21 |
| 2020 | 22 | 18 |
| 2021 | 12 | 7 |
| 2022 | 13 | 12 |
| 2023 | 7 | 11 |
| 2024 | 12 | 5 |
| 2025 | 8 | 8 |
| 2026 | 1 | 5 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Process for manufacturing a micro-electro-mechanical device from a single semiconductor wafer and related MEMS device31 Mar 2026US 12,589,989 B2STMicroelectronics S,r.l.
- Hermetically sealed transparent cavity and package for same19 Aug 2025US 12,391,544 B2Schott AG
- Cover for an infrared detector and a method of fabricating a cover for an infrared detector5 Aug 2025US 12,379,534 B2Meridian Innovation Pte Ltd
- Seal for microelectronic assembly5 Aug 2025US 12,381,119 B2Adeia Semiconductor Bonding Technologies Inc.
- MEMS resonator integrated cicruit fabrication22 Jul 2025US 12,365,582 B2SiTime Corporation
- Micro-electro-mechanical system package and fabrication method thereof1 Oct 2026US 2026/0296879 A1Vanguard International Semiconductor Corporation
- Manufacturing method for microelectromechanical devices and microelectromechanical device thereof20 Aug 2026US 2026/0242211 A1STMicroelectronics International N. V.
- Micromechanical pressure sensor with enclosed housing wall23 Jul 2026US 2026/0209031 A1
- Polymer nanofiber environmental barrier structure30 Apr 2026US 2026/0116743 A1Infineon Technologies AG
- Device encapsulation using physical vapor deposition5 Feb 2026US 2026/0035238 A1
Most cited
By later US patents
- Display device with micromechanical leaf spring switches250US 4,681,403 AU. S. Philips Corporation · 1987
- Lid wafer bond packaging and micromachining205US 5,915,168 AHarris Corporation · 1999
- Wafer-level MEMS packaging205US 6,635,509 B1DALSA Semiconductor Inc. · 2003
- Protection of microelectronic devices during packaging182US 6,335,224 B12002
- Seal for microelectronic assembly142US 10,508,030 B2Invensas Bonding Technologies, Inc. · 2019