Process for manufacturing a micro-electro-mechanical device from a single semiconductor wafer and related MEMS device

A method comprising:

• forming a base region;
• forming a structural layer including semiconductor material on the base region;
• forming at least one movable mass of a micro-electro-mechanical system (MEMS) device over a rotor metalization and at least one stator over a conductive stator region by forming a plurality of first openings in the structural layer;
• forming a ceiling layer of semiconductor material on the structural layer;
• forming a plurality of second openings in the ceiling layer;
• forming a permeable layer on the ceiling layer and over the plurality of second openings;
• and
• forming a sealing layer of semiconductor material on the permeable layer.

A method, comprising:

• forming a first sacrificial region on a semiconductor wafer;
• forming a structural layer of semiconductor material on the first sacrificial region;
• forming a plurality of first openings in the structural layer, the plurality of first openings exposing portions of the first sacrificial region, at least one of the plurality of first openings defining a movable mass in the structural layer over a rotor metalization and at least one stator over a conductive stator region;
• forming a second sacrificial region on the structural layer, the second sacrificial region extending over the plurality of first openings;
• forming a ceiling layer of semiconductor material on the second sacrificial region;
• forming a plurality of second openings in the ceiling layer, the plurality of second openings exposing portions of the second sacrificial region;
• forming a permeable layer on the ceiling layer, the permeable layer extending over the plurality of second openings;
• releasing the movable mass in the structural layer by removing portions of the first sacrificial region and the second sacrificial region;
• and
• forming a sealing layer of semiconductor material on the permeable layer.