H10W 90/721
Of bump connectors
Official title: {of bump connectors}
H10W90/721 (Of bump connectors) appears on 39,109 US grants and 47,723 published applications in this corpus.
Search patents in H10W- Granted patents
- 39,109
- Published applications
- 47,723
- Assignees
- 3,385
- Inventors
- 38,853
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 5 | 0 |
| 1978 | 6 | 0 |
| 1979 | 3 | 0 |
| 1980 | 9 | 0 |
| 1981 | 9 | 0 |
| 1982 | 6 | 0 |
| 1983 | 12 | 0 |
| 1984 | 7 | 0 |
| 1985 | 11 | 0 |
| 1986 | 17 | 0 |
| 1987 | 20 | 0 |
| 1988 | 17 | 0 |
| 1989 | 27 | 0 |
| 1990 | 39 | 0 |
| 1991 | 47 | 0 |
| 1992 | 58 | 0 |
| 1993 | 62 | 0 |
| 1994 | 97 | 0 |
| 1995 | 112 | 0 |
| 1996 | 111 | 0 |
| 1997 | 151 | 0 |
| 1998 | 260 | 0 |
| 1999 | 336 | 0 |
| 2000 | 372 | 0 |
| 2001 | 520 | 272 |
| 2002 | 650 | 828 |
| 2003 | 701 | 842 |
| 2004 | 718 | 1084 |
| 2005 | 728 | 1239 |
| 2006 | 817 | 1247 |
| 2007 | 821 | 1413 |
| 2008 | 786 | 1537 |
| 2009 | 836 | 1539 |
| 2010 | 1238 | 1555 |
| 2011 | 1348 | 1579 |
| 2012 | 1408 | 1941 |
| 2013 | 1593 | 1935 |
| 2014 | 1835 | 2173 |
| 2015 | 2002 | 2319 |
| 2016 | 2117 | 2104 |
| 2017 | 2247 | 2135 |
| 2018 | 1961 | 2082 |
| 2019 | 2046 | 2299 |
| 2020 | 2088 | 2729 |
| 2021 | 1949 | 2537 |
| 2022 | 2066 | 2543 |
| 2023 | 2095 | 2289 |
| 2024 | 1842 | 2742 |
| 2025 | 1732 | 2803 |
| 2026 | 1168 | 1957 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H10W 90/724Between a chip and a stacked insulating package substrate, interposer or rdl31,569
- H10W 90/722Between stacked chips15,200
- H10W 90/726Between a chip and a stacked lead frame, conducting package substrate or2,039
- H10W 90/728Between a chip and a stacked discrete passive device520
- H10W 90/725Between a chip and a laterally-adjacent insulating package substrate, interposer or rdl153
- H10W 90/723Between laterally-adjacent chips57
- H10W 90/729Between a chip and a laterally-adjacent discrete passive device10
- H10W 90/7295On the rear surface of insulating package substrates, interposers or rdls, for4
All 9 subgroupsShow fewer
Recent patents
- Semiconductor package structure having a chip stack6 Oct 2026US 12,757,412 B2Changxin Memory Technologies, Inc.
- Image sensor package including a chip stack structure6 Oct 2026US 12,757,506 B2Samsung Electronics Co., Ltd.
- Package structure and manufacturing method thereof6 Oct 2026US 12,757,706 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Integrated hybrid heat dissipation system that maximizes heat transfer from heterogeneous integration6 Oct 2026US 12,757,730 B2
- Inverted memory stack6 Oct 2026US 12,757,735 B2Advanced Micro Devices, Inc.
- Interconnect structure and method of forming same8 Oct 2026US 2026/0306859 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor devices configured for repairing defective bumps8 Oct 2026US 2026/0309777 A1SK hynix Inc.
- Wiring substrate8 Oct 2026US 2026/0309912 A1Ibiden Co., Ltd.
- Electronic package and manufacturing method thereof8 Oct 2026US 2026/0309937 A1Siliconware Precision Industries Co., Ltd.
- Electronic circuit layers for photonic interconnect platforms8 Oct 2026US 2026/0314026 A1
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Package systems having interposers1,064US 9,048,233 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015