H10W 90/728
Between a chip and a stacked discrete passive device
Official title: {between a chip and a stacked discrete passive device, e.g. resistors, capacitors or inductors}
H10W90/728 (Between a chip and a stacked discrete passive device) appears on 520 US grants and 644 published applications in this corpus.
Search patents in H10W- Granted patents
- 520
- Published applications
- 644
- Assignees
- 158
- Inventors
- 1,083
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 0 | 0 |
| 2000 | 0 | 0 |
| 2001 | 5 | 3 |
| 2002 | 4 | 5 |
| 2003 | 7 | 8 |
| 2004 | 3 | 12 |
| 2005 | 12 | 26 |
| 2006 | 11 | 13 |
| 2007 | 13 | 9 |
| 2008 | 11 | 17 |
| 2009 | 9 | 7 |
| 2010 | 6 | 12 |
| 2011 | 12 | 8 |
| 2012 | 17 | 18 |
| 2013 | 7 | 16 |
| 2014 | 19 | 25 |
| 2015 | 15 | 34 |
| 2016 | 30 | 37 |
| 2017 | 36 | 43 |
| 2018 | 35 | 43 |
| 2019 | 40 | 40 |
| 2020 | 34 | 49 |
| 2021 | 28 | 43 |
| 2022 | 45 | 49 |
| 2023 | 42 | 34 |
| 2024 | 27 | 38 |
| 2025 | 32 | 27 |
| 2026 | 19 | 28 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Substrate-on-die package architecture4 Aug 2026US 12,702,021 B2Texas Instruments Incorporated
- Three-dimensional semiconductor package having a stacked passive device4 Aug 2026US 12,702,058 B2Advanced Micro Devices, Inc.
- Multichip IC devices in glass medium and including an interconnect bridge die14 Jul 2026US 12,685,194 B2Intel Corporation
- Semiconductor device that uses bonding layer to join semiconductor substrates together23 Jun 2026US 12,667,000 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Package substrate with a mold extension1 Oct 2026US 2026/0305392 A1Intel Corporation
- Warpage reset layer on land side of substrate1 Oct 2026US 2026/0305418 A1Intel Corporation
- Under-Bump-Metallization Structure and Redistribution Layer Design for Integrated Fan-Out Package with Integrated Passive Device17 Sep 2026US 2026/0283028 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Integration of Discrete Embeddable Capacitors on Integrated Circuit Chips17 Sep 2026US 2026/0283042 A1Murata Manufacturing Co., Ltd.
- Semiconductor package including integrated voltage regulator and capacitor20 Aug 2026US 2026/0248048 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Structures and methods for low temperature bonding using nanoparticles162US 10,892,246 B2Invensas Corporation · 2021
- Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor127US 6,952,049 B1Ngk Spark Plug Co., Ltd. · 2005
- Switched-capacitor power supply system and method119US 7,190,210 B2Integral Wave Technologies, Inc. · 2007
- Internally decoupled integrated circuit package112US 5,095,402 ARogers Corporation · 1992
- Integrated circuit chip using top post-passivation technology and bottom structure technology110US 8,456,856 B2Megica Corporation · 2013