Package substrate with a mold extension

Abstract

Embodiments disclosed herein include an apparatus that comprises a substrate with a first surface and a second surface opposite from the first surface, where the first surface has a first flatness, a first pillar on the first surface of the substrate, and a second pillar on the first surface of the substrate. In an embodiment, a component is on the first surface of the substrate, where the component is between the first pillar and the second pillar. In an embodiment, a layer is over the first surface of the substrate, where the layer embeds the first pillar, the second pillar, and the component, and where a third surface of the layer facing away from the substrate has a second flatness that is flatter than the first flatness.

Dependencies are inferred from the claim text.