H10W 90/722
Between stacked chips
Official title: {between stacked chips}
H10W90/722 (Between stacked chips) appears on 15,200 US grants and 19,449 published applications in this corpus.
Search patents in H10W- Granted patents
- 15,200
- Published applications
- 19,449
- Assignees
- 1,446
- Inventors
- 15,907
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 3 | 0 |
| 1984 | 1 | 0 |
| 1985 | 1 | 0 |
| 1986 | 3 | 0 |
| 1987 | 3 | 0 |
| 1988 | 4 | 0 |
| 1989 | 5 | 0 |
| 1990 | 5 | 0 |
| 1991 | 7 | 0 |
| 1992 | 8 | 0 |
| 1993 | 9 | 0 |
| 1994 | 17 | 0 |
| 1995 | 26 | 0 |
| 1996 | 28 | 0 |
| 1997 | 43 | 0 |
| 1998 | 68 | 0 |
| 1999 | 67 | 0 |
| 2000 | 86 | 0 |
| 2001 | 102 | 64 |
| 2002 | 128 | 185 |
| 2003 | 159 | 208 |
| 2004 | 180 | 297 |
| 2005 | 167 | 324 |
| 2006 | 233 | 353 |
| 2007 | 212 | 435 |
| 2008 | 224 | 538 |
| 2009 | 262 | 552 |
| 2010 | 447 | 654 |
| 2011 | 553 | 681 |
| 2012 | 603 | 867 |
| 2013 | 716 | 826 |
| 2014 | 834 | 900 |
| 2015 | 866 | 1015 |
| 2016 | 927 | 827 |
| 2017 | 911 | 857 |
| 2018 | 837 | 812 |
| 2019 | 828 | 968 |
| 2020 | 840 | 1093 |
| 2021 | 825 | 1119 |
| 2022 | 877 | 1120 |
| 2023 | 946 | 1069 |
| 2024 | 837 | 1345 |
| 2025 | 821 | 1415 |
| 2026 | 479 | 925 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Image sensor package including a chip stack structure6 Oct 2026US 12,757,506 B2Samsung Electronics Co., Ltd.
- Package structure and manufacturing method thereof6 Oct 2026US 12,757,706 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Inverted memory stack6 Oct 2026US 12,757,735 B2Advanced Micro Devices, Inc.
- Semiconductor package6 Oct 2026US 12,757,763 B2Samsung Electronics Co., Ltd.
- Semiconductor device and method of fabricating the same6 Oct 2026US 12,757,777 B2Samsung Electronics Co., Ltd.
- Interconnect structure and method of forming same8 Oct 2026US 2026/0306859 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor devices configured for repairing defective bumps8 Oct 2026US 2026/0309777 A1SK hynix Inc.
- Electronic package and manufacturing method thereof8 Oct 2026US 2026/0309937 A1Siliconware Precision Industries Co., Ltd.
- Electronic circuit layers for photonic interconnect platforms8 Oct 2026US 2026/0314026 A1
- Semiconductor structures with through via8 Oct 2026US 2026/0314366 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Method of fabricating interconnect structure for package-on-package devices1,078US 9,048,222 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- Package systems having interposers1,064US 9,048,233 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- System, method, and computer program product for improving memory systems1,021US 9,432,298 B1P4Tents1, LLC · 2016