Electronic package and manufacturing method thereof
AssigneeSiliconware Precision Industries Co., Ltd.
InventorTing-Hsuan CHEN
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Abstract
An electronic package and a manufacturing method thereof are provided. The electronic package includes an electronic element, an electronic connector disposed on the electronic element, a photonic chip disposed on the electronic element, and a transmission component connected to the electronic connector. The electronic connector has at least one light-guiding member, and optical signals of the transmission component are reflected into a side surface of the photonic chip via the at least one light-guiding member to meet the requirements of low energy loss.
Claims28
An electronic package, comprising:
- an electronic element;
- an electronic connector disposed on the electronic element and having a first light-guiding member;
- a photonic chip disposed on the electronic element, wherein the first light-guiding member is located correspondingly to a side surface of the photonic chip;
- and
- a transmission component connected to the electronic connector.
A method of manufacturing an electronic package, comprising:
- providing a wafer-level substrate including a plurality of electronic elements;
- disposing an electronic connector having a first light-guiding member on each of the plurality of electronic elements;
- disposing a photonic chip on each of the plurality of electronic elements, wherein the first light-guiding member is located correspondingly on a side surface of the photonic chip to form a plurality of package modules;
- performing a singulation process on the wafer-level substrate to separate the plurality of package modules;
- and
- connecting a transmission component to the electronic connector.
Dependencies are inferred from the claim text.