H10W 90/727
Between a chip and a laterally-adjacent lead frame, conducting package substrate or
Official title: {between a chip and a laterally-adjacent lead frame, conducting package substrate or heat sink}
H10W90/727 (Between a chip and a laterally-adjacent lead frame, conducting package substrate or) appears on 3 US grants and 11 published applications in this corpus.
Search patents in H10W- Granted patents
- 3
- Published applications
- 11
- Assignees
- 9
- Inventors
- 36
- Latest grant
- 18 Feb 2020
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2016 | 0 | 1 |
| 2017 | 1 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 2 | 1 |
| 2021 | 0 | 0 |
| 2022 | 0 | 0 |
| 2023 | 0 | 1 |
| 2024 | 0 | 1 |
| 2025 | 0 | 6 |
| 2026 | 0 | 1 |
By publication year. 2026 runs to 8 Oct.
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Most cited
By later US patents