Wiring substrate
AssigneeShinko Electric Industries Co., Ltd.
InventorYoshihiro Machida
Life of this patent
Estimating the term…
Abstract
A wiring substrate includes a first substrate and an electronic component mounted on an upper surface of the first substrate. A first pad is formed on an uppermost wiring layer of the first substrate. A connection terminal is formed on the electronic component and is located proximate to the first pad in a plan view. The wiring substrate further includes a connection member formed on the first pad to electrically connect the first pad and the connection terminal. The connection member includes a rod-shaped core and a solder layer, which is coated around the core and joined to the first pad. The solder layer includes a bulge that spreads from the core of the connection member in a planar direction. The bulge is joined to the connection terminal of the electronic component.
Claims9
A wiring substrate comprising:
- a first substrate including an uppermost wiring layer;
- a first pad formed on the uppermost wiring layer of the first substrate;
- a second substrate mounted above the first substrate and including a lowermost wiring layer;
- a second pad formed on the lowermost wiring layer of the second substrate and located at a position facing the first pad of the first substrate;
- an electronic component mounted on an upper surface of the first substrate and located between the first substrate and the second substrate;
- a connection terminal formed on the electronic component and located proximate to the first pad in a plan view;
- and
- a connection member joined to the first pad, the second pad, and the connection terminal to electrically connect the first pad, the second pad, and the connection terminal,
- wherein the connection member includes
- a rod-shaped core, and
- a solder layer coated around the core and joined to the first pad and the second pad, and
- the solder layer includes a bulge that spreads from the core of the connection member in a planar direction, the bulge being joined to the connection terminal of the electronic component.
A wiring substrate comprising:
- a first substrate including an uppermost wiring layer;
- a first pad formed on the uppermost wiring layer of the first substrate;
- an electronic component mounted on an upper surface of the first substrate;
- a connection terminal formed on the electronic component and located proximate to the first pad in a plan view;
- and
- a connection member formed on the first pad to electrically connect the first pad and the connection terminal, wherein
- the connection member includes a rod-shaped core, and
- a solder layer coated around the core and joined to the first pad;
- the solder layer includes a bulge that spreads from the core of the connection member in a planar direction, the bulge being joined to the connection terminal of the electronic component;
- the electronic component comprises a semiconductor chip that includes a semiconductor substrate having a circuit formation surface and an electrode terminal arranged on the circuit formation surface of the semiconductor substrate;
- the semiconductor chip is mounted on the first substrate with a surface opposite to the circuit formation surface faced toward the first substrate;
- and
- the electrode terminal of the semiconductor chip functions as the connection terminal.
A wiring substrate comprising:
- a first substrate including an uppermost wiring layer;
- a first pad formed on the uppermost wiring layer of the first substrate;
- an electronic component mounted on an upper surface of the first substrate;
- a connection terminal formed on the electronic component and located proximate to the first pad in a plan view;
- and
- a connection member formed on the first pad to electrically connect the first pad and the connection terminal, wherein:
- the connection member includes
- a rod-shaped core, and
- a solder layer coated around the core and joined to the first pad;
- the solder layer includes a bulge that spreads from the core of the connection member in a planar direction, the bulge being joined to the connection terminal of the electronic component;
- the electronic component includes a semiconductor chip that includes a semiconductor substrate having a circuit formation surface and an electrode terminal arranged on the circuit formation surface of the semiconductor substrate;
- the semiconductor chip is mounted on the first substrate with the circuit formation surface faced toward the first substrate;
- and
- the electrode terminal of the semiconductor chip functions as the connection terminal.
Dependencies are inferred from the claim text.