H10W 90/7295
On the rear surface of insulating package substrates, interposers or rdls, for
Official title: {on the rear surface of insulating package substrates, interposers or RDLs, for connection outside of the package, e.g. ball grid array [BGA] bumps}
H10W90/7295 (On the rear surface of insulating package substrates, interposers or rdls, for) appears on 4 US grants and 113 published applications in this corpus.
Search patents in H10W- Granted patents
- 4
- Published applications
- 113
- Assignees
- 44
- Inventors
- 342
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 0 | 0 |
| 2012 | 1 | 0 |
| 2013 | 0 | 0 |
| 2014 | 0 | 0 |
| 2015 | 0 | 0 |
| 2016 | 0 | 0 |
| 2017 | 0 | 0 |
| 2018 | 0 | 0 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 0 | 1 |
| 2022 | 0 | 2 |
| 2023 | 1 | 1 |
| 2024 | 1 | 6 |
| 2025 | 0 | 2 |
| 2026 | 1 | 100 |
By publication year. 2026 runs to 8 Oct.
Recent patents
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Most cited
By later US patents