Electronic devices and methods of manufacturing electronic devices

A method of manufacturing an electronic device, comprising:

• providing a first carrier comprising an inner side;
• coupling interconnect structures and a first electronic component to the first carrier, wherein an active side of the first electronic component and proximate ends of the interconnect structures are adjacent to the inner side of the first carrier;
• providing encapsulant covering the interconnect structures and the first electronic component;
• removing a top portion of the encapsulant to expose distal ends of the interconnect structures;
• providing a shield over a top side of the encapsulant, wherein the shield is coupled to the interconnect structures;
• removing the first carrier;
• coupling a second carrier to the shield;
• providing a substrate coupled to the proximate ends of the interconnect structures and the active side of the first electronic component;
• and
• singulating the substrate, the encapsulant, and the shield to provide the electronic device.

An electronic device, comprising:

• a redistribution layer substrate (RDL substrate) comprising an inner side and an outer side;
• electronic components comprising component connectors coupled to the inner side of the RDL substrate;
• interconnect structures coupled to the inner side of the RDL substrate and adjacent to the electronic components;
• an encapsulant covering the electronic components and the interconnect structures, wherein distal ends of the interconnect structures are exposed from an upper side of the encapsulant;
• a top shield on the upper side of the encapsulant and coupled to the interconnect structures, wherein the encapsulant comprises lateral sides, and wherein the lateral sides are devoid of the top shield;
• and
• external interconnects coupled to the outer side of the RDL substrate, wherein the top shield and the interconnect structures provide a shielding structure for the electronic device.