Tcdram device assembly and method thereof
AssigneeMicron Technology, Inc.
InventorJungbae Lee
Life of this patent
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Abstract
A semiconductor device assembly is disclosed. The semiconductor device assembly includes a substrate, one or more memory devices disposed on the substrate, and a bulk material layer disposed on the substrate, the bulk material surrounding vertical edges of each of the one or more memory devices. The semiconductor device assembly also includes an insulating layer disposed between the one or more memory devices and the surrounding bulk material layer, and a semiconductor layer disposed on the one or more memory devices and the bulk material layer, the semiconductor layer is bonded with the one or more memory devices through a bonding interface layer. The semiconductor device assembly further includes a plurality of micro bumps disposed on the semiconductor layer.
Claims20
A semiconductor device assembly, comprising:
- a substrate;
- one or more memory devices disposed on the substrate;
- a bulk material layer disposed on the substrate, the bulk material surrounding vertical edges of each of the one or more memory devices;
- an insulating layer disposed between the one or more memory devices and the surrounding bulk material layer;
- a semiconductor layer disposed on the one or more memory devices and the bulk material layer, the semiconductor layer is bonded with the one or more memory devices through a bonding interface layer;
- and
- a plurality of micro bumps disposed on the semiconductor layer.
A semiconductor device assembly, comprising:
- a semiconductor layer comprising transistors, passive devices, redistribution layers, and signal routing layers;
- one or more memory devices disposed on the semiconductor layer;
- a bulk material layer disposed on the semiconductor layer, the bulk material surrounding edges of each one of the one or more memory devices;
- an insulating layer disposed between the one or more memory devices and surrounding bulk material layer;
- and
- a plurality of micro bumps disposed under the semiconductor layer.
A method of semiconductor device assembly, comprising:
- bonding a semiconductor device wafer on a carrier wafer to form a flat interface therebetween, the semiconductor device wafer having a frontside surface facing towards the carrier wafer;
- thinning the semiconductor device wafer from its backside surface;
- patterning the semiconductor device wafer from its backside surface and removing bulk material of the semiconductor device wafer to expose a semiconductor layer that is disposed on the frontside surface of the semiconductor device wafer;
- forming a bonding layer on the exposed surface of the semiconductor layer;
- bonding one or more memory devices on the exposed semiconductor layer;
- and
- filling insulating material into gaps between each of the one or more memory devices and surrounding bulk material layer of the semiconductor device wafer.
Dependencies are inferred from the claim text.