Package-on-package (POP) type semiconductor packages

A package-on-package (POP)-type semiconductor package comprising:

• a lower package having a first size and comprising a lower package substrate, an upper redistribution structure, a lower semiconductor chip, and alignment marks, wherein the lower semiconductor chip is in the lower package substrate, and the upper redistribution structure extends on the lower package substrate and the lower semiconductor chip;
• and
• an upper package having a second size smaller than the first size and comprising an upper package substrate and an upper semiconductor chip, wherein the upper package substrate is mounted on the upper redistribution structure of the lower package and is electrically connected to the lower package, and the upper semiconductor chip is on the upper package substrate,
• wherein each of the alignment marks comprises a first portion overlapped by the upper package, and
• wherein each of the alignment marks further comprises a second portion not overlapped by the upper package.

A package-on-package (POP)-type semiconductor package comprising:

• a lower package having a first size and comprising a lower package substrate, an upper redistribution structure, a lower semiconductor chip, and alignment marks, wherein the lower semiconductor chip is in the lower package substrate, and the upper redistribution structure extends on the lower package substrate and the lower semiconductor chip;
• and
• an upper package having a second size smaller than the first size and comprising an upper package substrate and an upper semiconductor chip, wherein the upper package substrate is mounted on the upper redistribution structure of the lower package and is electrically connected to the lower package, and the upper semiconductor chip is on the upper package substrate,
• wherein the alignment marks indicate an outline of the upper package, and the alignment marks are below and adjacent to the outline of the upper package,
• the alignment marks are between the lower package substrate and the upper package substrate, and
• each of the alignment marks comprises a first portion overlapped by the upper package and a second portion not overlapped by the upper package.