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US 12,183,722 B2Granted
Molded interconnects in bridges for integrated-circuit packages
AssigneeIntel Corporation
InventorsJenny Shio Yin Ong, Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong
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Abstract
Disclosed embodiments include molded interconnect bridges that are in a molded frame, where the molded frame includes passive devices that couple to a metal buildup layer that includes at least one power rail and one ground rail. The molded interconnects bridge is embedded in an integrated-circuit package substrate between a die side and a land side, and closer to the die side.
Claims23
An apparatus, comprising:
- a substrate including a die side and a land side;
- and
- a molded interconnects bridge including:
- a molding-mass frame including a die side and a package side, wherein the molding-mass frame is embedded in the substrate, and wherein the molding-mass frame is closer to the die side of the substrate than to the land side of the substrate;
- a capacitor in the molding-mass frame, wherein the capacitor occupies at least some of the same vertical space encompassed by the molding-mass frame, the capacitor including a first conductive region, a second conductive region, and a dielectric region located between the first conductive region and the second conductive region;
- and
- a build-up layer on the die side of the molding-mass frame, wherein the build-up layer is closer to the die side of the substrate than to the land side of the substrate, wherein the build-up layer includes a first conductive trace electrically coupled to the first conductive region of the capacitor, and wherein the build-up layer further includes a second conductive trace electrically coupled to the second conductive region of the capacitor.
4 more elements
A computing system comprising:
- a substrate including a die side and a land side;
- a first integrated circuit die on the die side of the substrate;
- a second integrated circuit die on the die side of the substrate;
- a molded interconnects bridge including:
- a molding-mass frame including a die side and a package side, wherein the molding-mass frame is embedded in the substrate, and wherein the molding-mass frame is closer to the die side of the substrate than to the land side of the substrate;
- a capacitor in the molding-mass frame, wherein the capacitor occupies at least some of the same vertical space encompassed by the molding-mass frame, the capacitor including a first conductive region, a second conductive region, and a dielectric region located between the first conductive region and the second conductive region;
- and
- a build-up layer on the die side of the molding-mass frame, wherein the build-up layer is closer to the die side of the substrate than to the land side of the substrate, wherein the build-up layer includes a first conductive trace electrically coupled to the first conductive region of the capacitor, and wherein the build-up layer further includes a second conductive trace electrically coupled to the second conductive region of the capacitor;
- and
- a printed wiring board, wherein the substrate is coupled to the printed wiring board at the land side of the substrate.
7 more elements
An apparatus, comprising:
- a substrate including a top side and a bottom side;
- a molding-mass frame including a top side and a bottom side, wherein the molding-mass frame is embedded in the substrate and the molding-mass frame is closer to the top side of the substrate than to the bottom side of the substrate;
- a capacitor in the molding-mass frame, the capacitor including a first conductive region, a second conductive region, and a dielectric region located between the first conductive region and the second conductive region;
- and
- a redistribution layer on the top side of the molding-mass frame, wherein the redistribution layer includes a first conductive trace electrically coupled to the first conductive region of the capacitor and a second conductive trace electrically coupled to the second conductive region of the capacitor.
2 more elements
Dependencies are inferred from the claim text.