US 8,208,268 B2 · Semiconductor apparatus

Abstract

A semiconductor apparatus includes: first electronic components; a first circuit board, including first electronic component mounting pads on which the first electronic components are mounted; and a second circuit board located above the first circuit board, wherein the first electronic component mounting pads are arranged on a first face of the first circuit board, opposite the second circuit board, and the first circuit board and the second circuit board are electrically connected by internal connection terminals located between the first circuit board and the second circuit board, and wherein a recessed portion is formed in the second circuit board, opposite the first electronic components, in order to provide space to accommodate portions of the first electronic components.

Claims10

Dependent claims

A semiconductor apparatus comprising:

first electronic components;
a first circuit board including first electronic component mounting pads on which the first electronic components are mounted;
a second circuit board located above the first circuit board;
and
a sealing resin provided to seal a space between the first circuit board and the second circuit board, wherein
the first electronic component mounting pads are arranged on a first face of the first circuit board, opposite the second circuit board,
the first circuit board and the second circuit board are electrically connected by internal connection terminals located therebetween, and
a recessed portion is formed in the second circuit board opposite the first electronic components to accommodate portions of the first electronic components.

5 more elements

A semiconductor apparatus comprising:

first electronic components;
a first circuit board including first electronic component mounting pads on which the first electronic components are mounted;
a second circuit board, located below the first circuit board, that faces the first electronic components mounted on the first circuit board, the second circuit board having external connection terminals provided on a first surface of the second circuit board, wherein the first surface is opposite to a second surface of the second circuit board facing the first circuit board;
and
a sealing resin provided to seal a space between the first circuit board and the second circuit board, wherein
the first circuit board and the second circuit board are electrically connected by internal connection terminals located therebetween, and
an electronic component accommodating feedthrough portion, for accommodating portions of the first electronic components, is formed in the second circuit board and passes through a portion of the second circuit board that faces the first electronic components.

4 more elements

Dependencies are inferred from the claim text.

Semiconductor apparatus

Life of this patent

Semiconductor apparatus

Life of this patent

Abstract

Claims10