H10W 90/729
Between a chip and a laterally-adjacent discrete passive device
Official title: {between a chip and a laterally-adjacent discrete passive device}
H10W90/729 (Between a chip and a laterally-adjacent discrete passive device) appears on 10 US grants and 17 published applications in this corpus.
Search patents in H10W- Granted patents
- 10
- Published applications
- 17
- Assignees
- 13
- Inventors
- 59
- Latest grant
- 13 Jan 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2011 | 0 | 1 |
| 2012 | 0 | 1 |
| 2013 | 0 | 0 |
| 2014 | 1 | 4 |
| 2015 | 2 | 1 |
| 2016 | 3 | 1 |
| 2017 | 0 | 1 |
| 2018 | 1 | 1 |
| 2019 | 0 | 0 |
| 2020 | 0 | 0 |
| 2021 | 1 | 1 |
| 2022 | 0 | 0 |
| 2023 | 0 | 3 |
| 2024 | 0 | 0 |
| 2025 | 1 | 2 |
| 2026 | 1 | 1 |
By publication year. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package including stiffener13 Jan 2026US 12,525,548 B2Samsung Electronics Co., Ltd.
- Capacitor wire and electronic device including the same21 Oct 2025US 12,451,291 B2Samsung Electronics Co., Ltd.
- Device assembly structure and method of manufacturing the same30 Nov 2021US 11,189,604 B2Advanced Semiconductor Engineering, Inc.
- Fan-out package structure13 Nov 2018US 10,128,192 B2Mediatek Inc.
- Sensor and method for manufacturing sensor9 Feb 2016US 9,255,940 B2Seiko Epson Corporation
- Package comprising an integrated device and a passive device with vertically aligned metal layers25 Jun 2026US 2026/0182383 A1QUALCOMM Incorporated
- Semiconductor device27 Nov 2025US 2025/0364505 A1Kabushiki Kaisha Toshiba
- Semiconductor package and method for manufacturing same20 Mar 2025US 2025/0096097 A1Hana Micron Inc.
- Capacitor wire and electronic device including the same3 Aug 2023US 2023/0245828 A1Samsung Electronics Co., Ltd.
- Integrated device comprising pillar interconnects with variable shapes16 Mar 2023US 2023/0082120 A1QUALCOMM Incorporated
Most cited
By later US patents
- Integrated circuit package connected to a data transmission medium7US 8,805,132 B2International Business Machines Corporation · 2014
- Fan-out package structure2US 10,128,192 B2Mediatek Inc. · 2018
- Chip package1US 9,048,243 B2Novatek Microelectronics Corp. · 2015
- Chip package1US 9,245,857 B2Novatek Microelectronics Corp. · 2016