Semiconductor package and method for manufacturing same
AssigneeHana Micron Inc.
InventorsJae-Sung LIM, Donghyun KIM
Life of this patent
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Abstract
Disclosed is a semiconductor package and a method for manufacturing the same, wherein manufacturing costs and manufacturing processes may be further reduced. The semiconductor package includes, a first die, a second die arranged horizontally to the first die, a printed circuit board (PCB) layer including circuit and a PCB pillar extending upwards from the circuit so as to abut the first die or the second die, and a connecting structure disposed on an upper surface of the PCB layer between two different PCB pillars and conductively connected to each of the first die and the second die.
Claims20
A semiconductor package comprising:
- a first die;
- a second die arranged horizontally to the first die;
- a printed circuit board (PCB) layer comprising a circuit and a PCB pillar extending upwards from the circuit so as to abut the first die or the second die;
- and
- a connecting structure disposed on an upper surface of the PCB layer between two different PCB pillars and conductively connected to each of the first die and the second die.
A semiconductor package manufacturing method comprising the steps of:
- (a) forming a PCB pillar so as to extend upwards from a circuit of a PCB layer;
- (b) installing a connecting structure between two different PCB pillars;
- (c) forming a mold on the PCB layer and the connecting structure;
- (d) grinding the mold such that the upper end of the PCB pillar and the upper end of a connecting pillar extending upwards from the connecting structure are exposed outwards;
- and
- (e) installing a first die and a second die side by side horizontally on the upper end of the PCB layer and on the upper end of the connecting pillar such that each of the first die and the second die contact the connecting pillar conductively.
Dependencies are inferred from the claim text.