Package comprising an integrated device and a passive device with vertically aligned metal layers

Abstract

A package comprising a substrate comprising a plurality of substrate interconnects, wherein some substrate interconnects from the substrate interconnects are located on at least one substrate metal layer; an integrated device coupled to the substrate; and a passive device coupled to the substrate, wherein the passive device comprises at least one dielectric layer; and a plurality of interconnects, wherein the plurality of interconnects comprise a first plurality of interconnects that are located on a plurality of metal layers, and wherein the plurality of metal layers are aligned in a direction that is orthogonal to the at least one substrate metal layer of the substrate; and an encapsulation layer that at least partially encapsulates the integrated device and the passive device.

Dependencies are inferred from the claim text.