Chip package

A chip package structure, comprising:

• a package body, comprising:
• at least one first connection terminal electrically connected to a core circuit via a first interconnection structure;
• at least one second connection terminal electrically connected to an electrostatic discharge protection circuit via a second interconnection structure;
• and
• a third connection terminal electrically connected to the second interconnection structure;
• a first lead electrically connected to the second connection terminal for connecting an external circuit;
• and
• a second lead, separated from the first lead, electrically connecting the third connection terminal and the first connection terminal.

A chip package structure, comprising:

• a package body comprising a core circuit and an electrostatic discharge protection circuit, and a connection structure;
• a first lead electrically connected to the electrostatic discharge protection circuit and the connection structure;
• and
• a second lead electrically connected to the core circuit and the connection structure,
• wherein the connection structure is electrically connected between the first lead and the second lead and reduces an electrostatic discharge (ESD) current from transmitting though the second lead to the core circuit,
• wherein the first lead and the second lead are separated.

A chip package structure, comprising:

• a first chip;
• a second chip;
• an inner lead electrically connecting to the first chip and the second chip;
• and
• an outer lead electrically connecting one of the first chip and the second chip to an external circuit, wherein the inner lead and the outer lead are separate in structure,
• wherein at least one of the first chip and the second chip comprises a package body, comprising:
• a core circuit;
• an electrostatic discharge protection circuit;
• a first connection terminal electrically connected to the core circuit;
• a second connection terminal electrically connected to the electrostatic discharge protection circuit and the outer lead;
• a third connection terminal, wherein the inner lead electrically connects the first connection terminal and the third connection terminal;
• and
• a first interconnection structure electrically connected to the electrostatic discharge protection circuit, the second connection terminal and the third connection terminal.