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US 9,255,940 B2Granted
Sensor and method for manufacturing sensor
AssigneeSeiko Epson Corporation
InventorSatoshi Nakajima
Life of this patent
Estimating the term…
Abstract
A sensor includes: a substrate on which an active chip including a semiconductor circuit is disposed; and a passive chip including an acceleration sensor, and a thick portion and a thin portion, the thick portion being disposed on the substrate so as to be in contact therewith. An active chip terminal is disposed on the active chip. A passive chip terminal is disposed on the passive chip at the thin portion. The passive chip terminal and the active chip terminal face each other and are connected via a bump.
Claims6
A sensor comprising:
- a substrate on which an active chip including an active element is placed;
- and
- a plate-shaped passive chip including a passive element, wherein
- an active chip terminal connected with the active element is disposed on the active chip,
- the passive chip includes a portion having a first thickness in a thickness direction and a portion having a second thickness thicker than the first thickness, the portion having the second thickness being placed on the substrate,
- a passive chip terminal connected with the passive element is disposed on the passive chip at the portion having the first thickness, and
- the passive chip terminal and the active chip terminal face each other and are connected via a bump.
4 more elements
A method for manufacturing a sensor, comprising:
- bonding an active chip including an active element and an active chip terminal to a substrate using a thermosetting adhesive;
- and
- bonding a passive chip including a passive element and a passive chip terminal to the substrate using a thermosetting adhesive, wherein
- the passive chip has a plate shape and includes a portion having a first thickness in a thickness direction and a portion having a second thickness thicker than the first thickness, the portion having the first thickness being disposed with the passive chip terminal,
- in the bonding of the active chip, the active chip terminal is arranged to face the side opposite to the substrate, and
- in the bonding of the passive chip, the passive chip terminal and the active chip terminal are arranged with a bump interposed therebetween while the portion having the second thickness is bonded to the substrate.
3 more elements
Dependencies are inferred from the claim text.