US 11,189,604 B2 · Device assembly structure and method of manufacturing the same

Abstract

A device assembly structure includes a first device and at least one second device. The first device has a first active surface and a first backside surface opposite to the first active surface, and includes a plurality of first electrical contacts disposed adjacent to the first active surface. The second device has a second active surface and a second backside surface opposite to the second active surface, and includes a plurality of second electrical contacts disposed adjacent to the second active surface. The second active surface of the second device faces the first active surface of the first device, the second electrical contacts of the second device are electrically connected to the first electrical contacts of the first device, and a thickness of the second device is less than or equal to one fifth of a thickness of the first device.

Claims9

Dependent claims

A method of manufacturing a device assembly structure, comprising:

(a) electrically connecting and bonding at least one second electronic structure to a first electronic structure;
(b) thinning the second electronic structure by a first thinning process and a second thinning process, wherein the first thinning process is grinding, and the second thinning process is etching;
and
(c) removing portions of the second electronic structure to form a plurality of second devices and expose portions of the first electronic structure.

1 more element

Dependencies are inferred from the claim text.

Device assembly structure and method of manufacturing the same

Life of this patent

Device assembly structure and method of manufacturing the same

Life of this patent

Abstract

Claims9