H10W 90/724
Between a chip and a stacked insulating package substrate, interposer or rdl
Official title: {between a chip and a stacked insulating package substrate, interposer or RDL}
H10W90/724 (Between a chip and a stacked insulating package substrate, interposer or rdl) appears on 31,569 US grants and 38,811 published applications in this corpus.
Search patents in H10W- Granted patents
- 31,569
- Published applications
- 38,811
- Assignees
- 2,906
- Inventors
- 33,310
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 5 | 0 |
| 1978 | 5 | 0 |
| 1979 | 3 | 0 |
| 1980 | 8 | 0 |
| 1981 | 9 | 0 |
| 1982 | 5 | 0 |
| 1983 | 8 | 0 |
| 1984 | 6 | 0 |
| 1985 | 10 | 0 |
| 1986 | 12 | 0 |
| 1987 | 15 | 0 |
| 1988 | 12 | 0 |
| 1989 | 22 | 0 |
| 1990 | 36 | 0 |
| 1991 | 41 | 0 |
| 1992 | 45 | 0 |
| 1993 | 54 | 0 |
| 1994 | 78 | 0 |
| 1995 | 88 | 0 |
| 1996 | 88 | 0 |
| 1997 | 110 | 0 |
| 1998 | 200 | 0 |
| 1999 | 270 | 0 |
| 2000 | 304 | 0 |
| 2001 | 441 | 220 |
| 2002 | 544 | 674 |
| 2003 | 555 | 663 |
| 2004 | 566 | 879 |
| 2005 | 576 | 970 |
| 2006 | 641 | 982 |
| 2007 | 647 | 1087 |
| 2008 | 618 | 1178 |
| 2009 | 647 | 1166 |
| 2010 | 952 | 1170 |
| 2011 | 976 | 1206 |
| 2012 | 1069 | 1501 |
| 2013 | 1175 | 1583 |
| 2014 | 1430 | 1815 |
| 2015 | 1634 | 1911 |
| 2016 | 1744 | 1738 |
| 2017 | 1832 | 1760 |
| 2018 | 1637 | 1720 |
| 2019 | 1668 | 1913 |
| 2020 | 1705 | 2279 |
| 2021 | 1621 | 2144 |
| 2022 | 1753 | 2163 |
| 2023 | 1780 | 1865 |
| 2024 | 1535 | 2277 |
| 2025 | 1425 | 2294 |
| 2026 | 962 | 1653 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Semiconductor package structure having a chip stack6 Oct 2026US 12,757,412 B2Changxin Memory Technologies, Inc.
- Image sensor package including a chip stack structure6 Oct 2026US 12,757,506 B2Samsung Electronics Co., Ltd.
- Integrated hybrid heat dissipation system that maximizes heat transfer from heterogeneous integration6 Oct 2026US 12,757,730 B2
- Semiconductor package6 Oct 2026US 12,757,745 B2Samsung Electronics Co., Ltd.
- Metal pillar for conductive connection6 Oct 2026US 12,757,750 B2Duksan Hi-Metal Co., Ltd.
- Wiring substrate8 Oct 2026US 2026/0309912 A1Ibiden Co., Ltd.
- Package structure and method for forming the same8 Oct 2026US 2026/0314394 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device8 Oct 2026US 2026/0314398 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Electronic devices and methods of manufacturing electronic devices8 Oct 2026US 2026/0314399 A1Amkor Technology Singapore Holding Pte.Ltd.
- Creating a sintering metallization layer on exposed surfaces of silicon dies for dsmbgas to enhance heat dissipation8 Oct 2026US 2026/0314403 A1Qorvo US, Inc.
Most cited
By later US patents
- Methods of forming integrated circuit package1,886US 9,281,254 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Testing of semiconductor chips with microbumps1,870US 9,372,206 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Stacked semiconductor devices and methods of forming same1,870US 9,496,189 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Package systems having interposers1,064US 9,048,233 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2015
- System, method, and computer program product for improving memory systems1,021US 9,432,298 B1P4Tents1, LLC · 2016