H10W 90/725
Between a chip and a laterally-adjacent insulating package substrate, interposer or rdl
Official title: {between a chip and a laterally-adjacent insulating package substrate, interposer or RDL}
H10W90/725 (Between a chip and a laterally-adjacent insulating package substrate, interposer or rdl) appears on 153 US grants and 229 published applications in this corpus.
Search patents in H10W- Granted patents
- 153
- Published applications
- 229
- Assignees
- 85
- Inventors
- 507
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 2001 | 1 | 0 |
| 2002 | 0 | 0 |
| 2003 | 0 | 0 |
| 2004 | 0 | 0 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 1 | 0 |
| 2008 | 0 | 1 |
| 2009 | 0 | 1 |
| 2010 | 0 | 0 |
| 2011 | 2 | 2 |
| 2012 | 0 | 3 |
| 2013 | 3 | 3 |
| 2014 | 0 | 4 |
| 2015 | 5 | 6 |
| 2016 | 15 | 11 |
| 2017 | 15 | 17 |
| 2018 | 14 | 19 |
| 2019 | 15 | 16 |
| 2020 | 15 | 18 |
| 2021 | 7 | 11 |
| 2022 | 14 | 23 |
| 2023 | 13 | 11 |
| 2024 | 11 | 32 |
| 2025 | 13 | 40 |
| 2026 | 9 | 10 |
By publication year. 2026 runs to 8 Oct.
Recent patents
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- Semiconductor device and equipment30 Jun 2026US 12,672,588 B2Canon Kabushiki Kaisha
- Chip packages including substrate integrated waveguides16 Jun 2026US 12,658,550 B2Infineon Technologies AG
- Embedded lc modules for packaged semiconductor devices24 Sep 2026US 2026/0293667 A1Saras Micro Devices, Inc.
- Semiconductor package17 Sep 2026US 2026/0282983 A1Samsung Electronics Co., Ltd.
- Chip packages including substrate integrated waveguides3 Sep 2026US 2026/0261029 A1Infineon Technologies AG
- Stacked package structure and method for forming the same9 Jul 2026US 2026/0198387 A1JCET Microelectronics (Jiangyin) Co., LTD.
- Semiconductor device and equipment11 Jun 2026US 2026/0165210 A1Canon Kabushiki Kaisha
Most cited
By later US patents
- Contact arrangements for stackable microelectronic package structures with multiple ranks33US 9,349,707 B1Invensas Corporation · 2016
- Wafer level package26US 6,268,642 B1United Microelectronics Corp. · 2001
- Transient electronic device with ion-exchanged glass treated interposer26US 9,780,044 B2Palo Alto Research Center Incorporated · 2017
- Chip package with plank stack of semiconductor dies22US 8,390,109 B2Oracle America, Inc. · 2013
- Semiconductor package including a stacking element19US 8,405,213 B2Advanced Semiconductor Engineering, Inc. · 2013