Chip packages including substrate integrated waveguides
AssigneeInfineon Technologies AG
InventorsErnst Seler, Tuncay Erdöl, Ulrich Möeller
Life of this patent
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Abstract
A chip package includes a semiconductor chip and a substrate integrated waveguide. The substrate integrated waveguide includes a first metal layer, a second metal layer arranged over the first metal layer and a dielectric substrate arranged between the first metal layer and the second metal layer. The chip package further includes a slot formed in the second metal layer and a signal line electrically coupling the semiconductor chip and the second metal layer. The signal line crosses the slot when viewed in a direction perpendicular to the second metal layer.
Claims19
A chip package, comprising:
- a semiconductor chip;
- a substrate integrated waveguide, comprising a first metal layer, a second metal layer arranged over the first metal layer, and a dielectric substrate arranged between the first metal layer and the second metal layer;
- a slot formed in the second metal layer;
- and
- a signal line electrically coupling the semiconductor chip and the second metal layer, wherein the signal line crosses the slot when viewed in a direction perpendicular to the second metal layer,
- wherein a frequency of a signal transmitted via the signal line and/or a signal transmitted via the substrate integrated waveguide is greater than 1 GHz, and
- wherein the semiconductor chip comprises a monolithic microwave integrated circuit.
A method for manufacturing a chip package, wherein the method comprises:
- generating a substrate integrated waveguide, comprising a first metal layer, a second metal layer arranged over the first metal layer and a dielectric substrate arranged between the first metal layer and the second metal layer;
- forming a slot in the second metal layer;
- and
- providing an electrical coupling of the second metal layer and a semiconductor chip by a signal line, wherein the signal line crosses the slot when viewed in a direction perpendicular to the second metal layer,
- wherein a frequency of a signal transmitted via the signal line and/or a signal transmitted via the substrate integrated waveguide is greater than 1 GHz, and
- wherein the semiconductor chip comprises a monolithic microwave integrated circuit.
Dependencies are inferred from the claim text.