Sensor packages

A semiconductor device, comprising:

• a semiconductor die having a device side including circuitry and a sensor formed therein and a non-device side opposing the device side;
• a metal pillar coupled to and extending from the device side;
• a metal ring coupled to and extending from the device side, the metal ring defining a cavity that is vertically aligned with the sensor;
• a mold compound having a top surface closer to the device side than the non-device side and covering the semiconductor die, the metal pillar, and an external surface of the metal ring, the mold compound absent from the cavity;
• a tie bar extending across and exposed to the top surface of the mold compound and including a tie bar ring coupled to the metal ring, the tie bar ring thicker than a remainder of the tie bar;
• and
• a conductive member coupled to the metal pillar and extending to a bottom surface of the mold compound opposite the top surface of the mold compound, an entirety of the conductive member located farther from the top surface of the mold compound than the tie bar.

A method for manufacturing a package, comprising:

• plating a metal ring on a device side of a semiconductor die to at least partially define a cavity, the device side including circuitry and a sensor;
• plating a metal pillar on the device side of the semiconductor die;
• depositing solder on a top surface of the metal ring opposite the semiconductor die and on a top surface of the metal pillar;
• using the solder on the top surface of the metal ring to couple the metal ring to a tie bar extending approximately parallel to the semiconductor die;
• using the solder on the top surface of the metal pillar to couple the metal pillar to a conductive member having a horizontal member extending approximately parallel to the semiconductor die, a vertical member extending away from the horizontal member, and a conductive terminal extending horizontally away from the semiconductor die;
• and
• applying a mold compound to the device side of the semiconductor die and to an exterior surface of the metal ring facing away from the sensor, the mold compound absent from the cavity.