High-frequency module

A high-frequency module, comprising:

• a first module substrate including a first major surface and a second major surface that are opposite to each other;
• a second module substrate including a third major surface and a fourth major surface that are opposite to each other, the third major surface being disposed facing the second major surface;
• a plurality of electronic circuitry disposed between the second major surface and the third major surface, on the first major surface, and on the fourth major surface;
• and
• a plurality of external connection terminals disposed on the fourth major surface, wherein
• the plurality of electronic components include:
• a first electronic circuitry including a first filter coupled to a power amplifier;
• a second electronic circuitry including a second filter coupled to a low-noise amplifier, and
• a third electronic circuitry including the low-noise amplifier,
• the first electronic circuitry is disposed one of between the second major surface and the third major surface, on the first major surface, or on the fourth major surface,
• the second electronic circuitry is disposed one of between the second major surface and the third major surface, on the first major surface, or on the fourth major surface, and
• the third electronic circuitry is disposed one of between the second major surface and the third major surface, on the first major surface, or on the fourth major surface.