Embedded lc modules for packaged semiconductor devices

A package substrate of a semiconductor device, the package substrate comprising:

• a substrate core;
• a first LC module embedded in the substrate core and including a first inductor and a first capacitor;
• an input terminal of the first LC module on a first side of the substrate core connected to an input of the first inductor, the input terminal of the first LC module being configured to receive an input voltage Vi and an input current Ii that vary with time;
• an output terminal of the first LC module on a second side of the substrate core connected to an output of the first inductor and to an anode of the first capacitor, the output terminal of the first LC module being configured to output an output voltage Vo<Vi and an output current Io that vary with time;
• and
• a sense terminal on the first side of the substrate core connected to the output of the first inductor and to the anode of the first capacitor, the sense terminal providing a feedback loop for regulating an output of a prior stage active component.

A tile embeddable in a substrate of a semiconductor device, the tile comprising:

• a first LC module surrounded by a polymer encapsulation and including a first inductor and a first capacitor;
• an input terminal of the first LC module on a first side of the polymer encapsulation connected to an input of the first inductor, the input terminal of the first LC module being configured to receive an input voltage Vi and an input current Ii that vary with time;
• an output terminal of the first LC module on a second side of the polymer encapsulation connected to an output of the first inductor and to an anode of the first capacitor, the output terminal of the first LC module being configured to output an output voltage Vo<Vi and an output current Io that vary with time;
• and
• a sense terminal on the first side of the polymer encapsulation connected to the output of the first inductor and to the anode of the first capacitor, the sense terminal providing a feedback loop for regulating an output of a prior stage active component.

A semiconductor device comprising:

• a substrate;
• an integrated circuit die on the substrate;
• a first LC module embedded in the substrate in alignment with a first power rail of the integrated circuit die, the first LC module including a first inductor and a first capacitor;
• an input terminal of the first LC module on a first side of the substrate connected to an input of the first inductor, the input terminal of the first LC module being configured to receive an input voltage Vi and an input current Ii that vary with time;
• an output terminal of the first LC module on a second side of the substrate connected to an output of the first inductor and to an anode of the first capacitor, the output terminal of the first LC module being configured to output an output voltage Vo<Vi and an output current Io that vary with time;
• and
• a sense terminal on the first side of the substrate connected to the output of the first inductor and to the anode of the first capacitor, the sense terminal providing a feedback loop for regulating an output of a prior stage active component.