Contact arrangements for stackable microelectronic package structures with multiple ranks

A microelectronic assembly, comprising:

• a first substrate having a first and a second surface on opposite sides of the first substrate;
• and
• a plurality of contact arrangements disposed on the first surface of the first substrate;
• wherein the plurality of contact arrangements comprises:
• first contacts disposed as a first block and a first L-shaped region spaced apart from one another in a first quadrant of the plurality of contact arrangements on the first surface;
• second contacts disposed as a second block and a second L-shaped region spaced apart from one another in a second quadrant of the plurality of contact arrangements on the first surface;
• wherein the first contacts and the second contacts are for interconnection with first microelectronic dies and second microelectronic dies;
• wherein the first microelectronic dies and the second microelectronic dies are in same a package;
• and
• wherein the first microelectronic dies and the second microelectronic dies include at least two ranks thereof for commonly sharing the first contacts and the second contacts among the first microelectronic dies and the second microelectronic dies.

A method for forming a microelectronic assembly, comprising:

• obtaining a first substrate having a first surface and a second surface on opposite sides of the first substrate;
• forming a plurality of contact arrangements on the first surface of the first substrate;
• wherein the plurality of contact arrangements comprises:
• first contacts disposed as a first block and a first L-shaped region spaced apart from one another in a first quadrant of the plurality of contact arrangements on the first surface;
• second contacts disposed as a second block and a second L-shaped region spaced apart from one another in a second quadrant of the plurality of contact arrangements on the first surface;
• wherein the first contacts and the second contacts are for interconnection with first microelectronic dies and second microelectronic dies;
• wherein the first microelectronic dies and the second microelectronic dies are in same a package;
• and
• wherein the first microelectronic dies and the second microelectronic dies include at least two ranks thereof for commonly sharing the first contacts and the second contacts among the first microelectronic dies and the second microelectronic dies.